Patents by Inventor Ian F. Deviny

Ian F. Deviny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnecting layer on a semiconductor substrate
    Patent number: 5136355
    Abstract: A semiconductor arrangement includes a substrate having a plurality of transistors formed therein and a tungsten layer thereon in the form of elongate tracks serving to interconnect the transistors. Localized regions of highly doped semiconductor material underlie the tracks and form an ohmic contact therewith. The tungsten layer is overlaid with an electrically insulating oxide on which further electrical interconnections are present.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: August 4, 1992
    Assignee: Marconi Electronic Devices Limited
    Inventors: John A. Kerr, Ian F. Deviny