Abstract: The present disclosure describes an apparatus. The apparatus includes a chuck for placing an object thereon, a gas passage extending along a periphery of an outer sidewall of the chuck and separating the chuck into an inner portion and a sidewall portion, and a plurality of gas holes through the sidewall portion and configured to connect a gas external to the chuck to the gas passage.

Abstract: The present disclosure describes an apparatus. The apparatus includes a chuck for placing an object thereon, a gas passage extending along a periphery of an outer sidewall of the chuck and separating the chuck into an inner portion and a sidewall portion, and a plurality of gas holes through the sidewall portion and configured to connect a gas external to the chuck to the gas passage.

Abstract: The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber, a chuck housed in the chamber and configured to hold a substrate, and a control device configured to control a translational displacement and a rotation of the chuck. The chuck can include a passage extending along a periphery of the chuck and dividing the chuck into an inner portion and an outer sidewall portion, and a first multiple of openings through the outer sidewall portion of the chuck and interconnected with the passage. The passage can be configured to transport a fluid. The first multiple of openings can be configured to dispense the fluid.

Abstract: The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.

Abstract: The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber, a chuck housed in the chamber and configured to hold a substrate, and a control device configured to control a translational displacement and a rotation of the chuck. The chuck can include a passage extending along a periphery of the chuck and dividing the chuck into an inner portion and an outer sidewall portion, and a first multiple of openings through the outer sidewall portion of the chuck and interconnected with the passage. The passage can be configured to transport a fluid. The first multiple of openings can be configured to dispense the fluid.

Abstract: The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.

Abstract: The present disclosure describes an apparatus. The apparatus includes a chuck for placing an object thereon, a gas passage extending along a periphery of an outer sidewall of the chuck and separating the chuck into an inner portion and a sidewall portion, and a plurality of gas holes through the sidewall portion and configured to connect a gas external to the chuck to the gas passage.

Abstract: A encoding/decoding method and device for a remote controller utilizing a baud rate to encrypt data for transmission. The encoding device includes an encoder encoding an identification code into an encrypted code; and an interpreter interpreting the un-encoded portion of the identification code and the encrypted code into a transmission signal. When the encrypted code is in a first base, the plain code corresponding to the encrypted code will be transmitted with a first baud rate; and when the encrypted code is in a second base, the plain code corresponding to the encrypted code will be transmitted with a second baud rate. The decoding device includes a receiver receiving the transmission signal; a interpreter connected to the receiver interpreting the transmission signal into a received signal; an encoder utilizing the same encoding algorithm as in the transmitter to generate a comparison code; and a processor comparing the received signal and the comparison code.

Abstract: The present invention generally relates to encoding/decoding method and device used for remote controller, which utilizes baud rate to encrypt data for transmission. The encoding device of the present invention comprises an encoder for encoding an identification code into an encrypted code; an interpreter for interpreting the un-encoded portion of the identification code and the encrypted code into a transmission signal. Wherein, when the encrypted code is in a first base, the plain code corresponding to the encrypted code will be transmitted with a first baud rate; and when the encrypted code is in a second base, the plain code corresponding to the encrypted code will be transmitted with a second baud rate.

Abstract: A power module disclosed in the invention has a controller chip and a power chip disposed on a same die pad, which can be a standard die pad commonly seen in the industry so that a extra cost of making and designing a die pad especially for the power module can be saved. Moreover, since the controller chip can use a manufacturing process different than that of the power chip, the overall size of the power module of the invention is minimized by adopting two optimal manufacturing processes respective for making the controller chip and the power chip as small as possible.

Abstract: A signal transceiver for transmitting a carrier signal to a transponder and receiving a modulated data signal returned by the transponder is provided. The signal transceiver includes a transistor with a base, a collector and an emitter, a controller being electrically connected to the base and providing a controlling signal for turning on the transistor, an oscillation source being electrically connected to the collector for providing the carrier signal, a capacitor being electrically connected to the base and the oscillation source for forming an oscillation circuit, and a resonator being electrically connected to the collector for transmitting the carrier signal to the transponder and receiving the modulated data signal returned by the transponder, and outputting a demodulated data signal through the emitter.

Abstract: The present invention generally relates to encoding/decoding method and device used for remote controller, which utilizes baud rate to encrypt data for transmission. The encoding device of the present invention comprises an encoder for encoding an identification code into an encrypted code; an interpreter for interpreting the un-encoded portion of the identification code and the encrypted code into a transmission signal. Wherein, when the encrypted code is in a first base, the plain code corresponding to the encrypted code will be transmitted with a first baud rate; and when the encrypted code is in a second base, the plain code corresponding to the encrypted code will be transmitted with a second baud rate.

Abstract: A signal transceiver for transmitting a carrier signal to a transponder and receiving a modulated data signal returned by the transponder is provided. The signal transceiver includes a transistor with a base, a collector and an emitter, a controller being electrically connected to the base and providing a controlling signal for turning on the transistor, an oscillation source being electrically connected to the collector for providing the carrier signal, a capacitor being electrically connected to the base and the oscillation source for forming an oscillation circuit, and a resonator being electrically connected to the collector for transmitting the carrier signal to the transponder and receiving the modulated data signal returned by the transponder, and outputting a demodulated data signal through the emitter.