Abstract: A solar panel is provided with a stack including at least one back contacted solar cell and a back-sheet layer. The back-sheet layer has a patterned conductive layer of a first material. The conductive layer is arranged with contacting areas each located at a location corresponding to a location of an electrical contact on the solar cell. The solar cell is arranged on top of the conductive layer with the rear surface of the solar cell facing the patterned conductive surface. Each electrical contact of the solar cell is in contact with a corresponding contacting area on the conductor circuit by a body of conductive connecting material. The conductive layer includes at the location of the contacting area a patch of a second material. Each patch is arranged in between the body of conductive connecting material on one electrical contact and the layer of the first material.

Abstract: A solar panel (1) includes: a plurality of semiconductor substrate based solar cells (2), a transparent front side plate (4), and a rear side plate (6). The transparent front side plate (4) is stacked on top of the rear side plate (6) and the plurality of solar cells (2) are arranged in an array in between the rear side (6) plate and the front side plate (4). Each solar cell (2) has a light receiving surface facing (8) towards the front side plate (4); the solar cells (2) being embedded in an encapsulant layer (10) between the front side plate (4) and the rear side plate (6), wherein the solar panel includes an internal light redirection unit (12; 20) for guiding light received on the solar panel (1) but not captured by the solar cells (2), towards the solar cells (2).

Abstract: A method for manufacturing a solar cell module that includes a solar cell based on a semiconductor substrate with front and rear surfaces, includes—fabricating a solar cell from the substrate, and—depositing on at least the rear surface a coating layer. The deposition step includes applying a coating powder on at least the rear surface, forming an adhered powder layer on said surface. The method includes after the deposition step: performing a first annealing process on the solar cell module for transforming the adhered powder layer in a pre-annealed coating layer. Further the method includes—creating open contacting areas on the solar cell by removal of the adhered powder layer at locations of contacting areas on the solar cell , wherein the removal precedes the first annealing process, or by masking contacting areas on the solar cell 1, wherein the masking precedes the deposition step.

Abstract: A solar panel is provided with a stack including at least one back contacted solar cell and a back-sheet layer. The back-sheet layer has a patterned conductive layer of a first material. The conductive layer is arranged with contacting areas each located at a location corresponding to a location of an electrical contact on the solar cell. The solar cell is arranged on top of the conductive layer with the rear surface of the solar cell facing the patterned conductive surface. Each electrical contact of the solar cell is in contact with a corresponding contacting area on the conductor circuit by a body of conductive connecting material. The conductive layer includes at the location of the contacting area a patch of a second material. Each patch is arranged in between the body of conductive connecting material on one electrical contact and the layer of the first material.

Abstract: A solar panel includes a stack of at least one back contacted solar cell, a first encapsulant layer and a back-sheet contact layer. The solar cell includes back side electrical contacts. The back contact sheet layer includes a patterned conductor circuit, which has contacting areas located at locations corresponding to locations of the electrical contacts on the at least one solar cell. The encapsulant layer has a pattern of openings at locations corresponding to the locations of the electrical contacts. The solar cell is arranged on top of the first encapsulant layer that is positioned on top of the back-sheet contact layer, with the rear surface of the at least one solar cell facing the patterned conductor circuit surface. Each electrical contact is connected through a corresponding opening in the first encapsulant layer with a respective corresponding contact area of the conductor circuit by an interconnecting body.