Patents by Inventor Ian Juland

Ian Juland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low creep metallization for optoelectronic applications
    Patent number: 8319236
    Abstract: A metallization on a semiconductor substrate is disclosed in the form of a laminate comprising a plurality of layers of a “conducting” metallization for providing electrical conductivity, interspersed with a plurality of layers of another metallization. By providing many layers the thickness of each individual layer can be reduced. Reduction in thickness of each layer leads to a reduction in grain size and a consequent reduction in creep over the lifetime of a device.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: November 27, 2012
    Assignee: Oclaro Technology Limited
    Inventors: Richard Beanland, Stephen Jones, Ian Juland
  • LOW CREEP METALLIZATION FOR OPTOELECTRONIC APPLICATIONS
    Publication number: 20080198885
    Abstract: A metallization on a semiconductor substrate is disclosed in the form of a laminate comprising a plurality of layers of a “conducting” metallization for providing electrical conductivity, interspersed with a plurality of layers of another metallization. By providing many layers the thickness of each individual layer can be reduced. Reduction in thickness of each layer leads to a reduction in grain size and a consequent reduction in creep over the lifetime of a device.
    Type: Application
    Filed: February 8, 2008
    Publication date: August 21, 2008
    Inventors: Richard BEANLAND, Stephen Jones, Ian Juland