Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

Abstract: An apparatus for manufacturing a nano-imprint lithography stamp from a master template stamp, including a stamp chuck configured to selectively secure a stamp backing material thereto, a master chuck configured to support a master template stamp, the master template stamp including a master pattern thereon, the master chuck configured to support the master template stamp in facing relationship to the stamp backing material when selectively secured to the stamp chuck, wherein the master template stamp includes an electromagnetic energy curable material on and in the master pattern, and the stamp chuck is configured and arranged to position a portion of the backing material thereon spaced therefrom and in contact with the electromagnetic energy curable material, and the stamp chuck is further configured to position the portion of the backing material in contact with the energy curable material, after it is cured, in contact with the stamp chuck.

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

Abstract: Methods for imprinting on abutted fields of a substrate are described. Generally, a first field of a substrate may be imprinted using an imprint lithography template. The template may then be placed such that a portion of the template overlaps the first field of the substrate while imprinting a second field of the substrate.

Abstract: Embodiments of the present disclosure generally relate to imprint compositions and materials and related processes useful for nanoimprint lithography (NIL). In one or more embodiments, an imprint composition contains one or more types of nanoparticles, one or more surface ligands, one or more solvents, one or more additives, and one or more acrylates.

Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.

Abstract: Embodiments of the present disclosure relate to measurement systems and methods for diffracting light. The measurement system includes a stage, an optical arm, and one or more detector arms. The method of diffracting light includes a method of diffracting light is provided, including projecting light beams having wavelength ?laser to a first zone of a first substrate at the fixed beam angle ?0 and the maximum orientation angle ?max, obtaining a displacement angle ??, determining a target maximum beam angle ?t-max, wherein ?t-max=?0+??, and determining a test grating pitch Pt-grating by a modified grating pitch equation Pt-grating=?laser/(sin ?t-max+sin ?0). The measurement system and method allow for measurement of nonuniform properties of regions of an optical device, such as grating pitches and grating orientations.

Abstract: Methods for imprinting on abutted fields of a substrate are described. Generally, a first field of a substrate may be imprinted using an imprint lithography template. The template may then be placed such that a portion of the template overlaps the first field of the substrate while imprinting a second field of the substrate.

Abstract: Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.

Abstract: Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.

Abstract: Imprint lithography system may provide for an energy source for solidification of material positioned between a template and a substrate. Additionally, the energy source and/or an additional energy source may be used to clean contaminants from the template and/or the substrate.

Abstract: Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.

Abstract: The present invention is directed towards a system for expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.

Abstract: Improved wetting characteristics together with improved release characteristics with respect to a substrate and an imprint lithography mold having imprinting material disposed therebetween.

Abstract: Droplets of polymerizable material may be patterned on a film sheet. The droplets of polymerizable material may be dispensed on the film sheet. A pre-determined force may be applied to an imprint lithography template such that localized trapping of the droplets of the polymerizable material on the film sheet is minimized and the droplets coalesce to form a continuous layer. The polymerizable material may be solidified to form a patterned layer having a residual layer and at least one feature.

Abstract: A template is treated to provide a surfactant rich region and a surfactant depleted region. A contact angle at the surfactant rich region may be greater than, less than, or substantially similar to a contact angle of the surfactant depleted region.

Abstract: A method/process for curing imprint on a template prior to contact with a substrate. A curing process is used to adhere the imprint to a wafer or substrate. Monomer is deposited on a template and then partially cured using a UV exposure. The exposure is controlled so that the imprint is cured past the gel point, but still retains a thin liquid layer of uncured monomer at the surface that will bond with the wafer. Further, this partially cured layer enables the alignment adjustments between the template and the substrate to be performed after contact between the two without pulling any monomer out of the features.

Abstract: Imprint lithography substrates may include alignment marks formed of high contrast material. Exemplary methods for forming alignment marks having high contrast material are described.

Abstract: Methods for imprinting on abutted fields of a substrate are described. Generally, a first field of a substrate may be imprinted using an imprint lithography template. The template may then be placed such that a portion of the template overlaps the first field of the substrate while imprinting a second field of the substrate.