Patents by Inventor Ian McPhee

Ian McPhee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Regulation of guanine nucleotide exchange factor for a protein belonging to the rap family of small gtpases
    Publication number: 20070197482
    Abstract: The invention relates generally to the methods of treating brain diseases and compounds for treating brain diseases, and more specifically relates to using compounds that are able to modulate guanine nucleotide exchange factors for proteins belonging to the Rap family of small GTPases to treat diseases of the brain, such as Alzheimer's and Schizophrenia.
    Type: Application
    Filed: May 4, 2004
    Publication date: August 23, 2007
    Applicant: Scottish Biomedical Limited
    Inventors: Ian McPhee, Catherine Breslin, Justin Kewney, Simon MacKenzie, Ann Cooreman, Lucien Charles Gibson, Morag McFarlane, Stephen Hammond
  • Coated stencil with reduced surface tension
    Patent number: 7093746
    Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surfaces absent the coating. The stencil can also have one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board). Solder paste can be printed through the aperture(s) of the stencil onto contact pads on a printed wiring board.
    Type: Grant
    Filed: July 26, 2004
    Date of Patent: August 22, 2006
    Assignee: Fry's Metals, Inc.
    Inventors: Ian McPhee Fleck, Ron Tripp, Prashant Chouta, Scott Craig
  • Solder printing using a stencil having a reverse-tapered aperture
    Patent number: 6988652
    Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: January 24, 2006
    Assignee: Fry's Metals, Inc.
    Inventors: Ian McPhee Fleck, Ron Tripp, Prashant Chouta, Scott Craig
  • Coated stencil with reduced surface tension
    Publication number: 20040261636
    Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surfaces absent the coating. The stencil can also have one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board). Solder paste can be printed through the aperture(s) of the stencil onto contact pads on a printed wiring board.
    Type: Application
    Filed: July 26, 2004
    Publication date: December 30, 2004
    Applicant: Fry's Metals, Inc. d/b/a Alpha Metals, Inc.
    Inventors: Ian McPhee Fleck, Ron Tripp, Prashant Chouta, Scott Craig
  • Solder printing using a stencil having a reverse-tapered aperture
    Publication number: 20030222125
    Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).
    Type: Application
    Filed: May 29, 2002
    Publication date: December 4, 2003
    Inventors: Ian McPhee Fleck, Ron Tripp, Prashant Chouta