Patents by Inventor Ian Nettleship

Ian Nettleship has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS AND METHOD FOR JOINING OF CARBIDE CERAMICS
    Publication number: 20210316473
    Abstract: A bonding tape for joining carbide ceramic structures, wherein the bonding tape comprises: a mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400° C.
    Type: Application
    Filed: February 1, 2021
    Publication date: October 14, 2021
    Inventors: Jung-Kun Lee, Ian Nettleship, Ryan W. Read
  • Apparatus and method for joining of carbide ceramics
    Patent number: 10906203
    Abstract: A method for joining carbide ceramic particles, comprising: forming a first mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400° C.; and heating the first mixture at a temperature of about 1150° C. to about 1400° C.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: February 2, 2021
    Assignee: UNIVERSITY OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION
    Inventors: Jung-Kun Lee, Ian Nettleship, Ryan W. Read
  • APPARATUS AND METHOD FOR JOINING OF CARBIDE CERAMICS
    Publication number: 20180126586
    Abstract: A method for joining carbide ceramic particles, comprising: forming a first mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400° C.; and heating the first mixture at a temperature of about 1150° C. to about 1400° C.
    Type: Application
    Filed: July 17, 2017
    Publication date: May 10, 2018
    Applicant: University of Pittsburgh - of the Commonwealth System of Higher Education
    Inventors: JUNG-KUN LEE, Ian Nettleship, Ryan W. Read