Patents by Inventor Ian Niemi

Ian Niemi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed Wiring Board with Dielectric Material Sections Having Different Dissipation Factors
    Publication number: 20120125664
    Abstract: An apparatus including a first printed wiring board section and a second printed wiring board section. The first printed wiring board section includes a first dielectric material layer. The first dielectric material layer has a first dissipation factor. The second printed wiring board section is directly attached with the first printed wiring board section to form a unitary printed wiring board structure. The second printed wiring board section includes a second dielectric material layer and an antenna on the second dielectric material layer. The second dielectric material layer has a different second dissipation factor.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Inventors: Ian Niemi, Ilkka Johannes Kartio, Kimmo Markus Perala, Kari Viljo Jalmari Virtanen, Hannu Vaino Kalevi Ventomaki
  • Printed wire board and associated mobile terminal
    Patent number: 7230187
    Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: June 12, 2007
    Assignee: Nokia Corporation
    Inventors: Liangfeng Xu, Tommi Reinikainen, Arni Kujala, Wei Ren, Ian Niemi, Ilkka Kartio
  • Printed wire board and associated mobile terminal
    Publication number: 20050135072
    Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.
    Type: Application
    Filed: December 22, 2003
    Publication date: June 23, 2005
    Applicant: Nokia Corporation
    Inventors: Liangfeng Xu, Tommi Reinikainen, Arni Kujala, Wei Ren, Ian Niemi, Ilkka Kartio