Patents by Inventor Ian Olson

Ian Olson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230144210
    Abstract: An electronic device includes a processor that performs a basic input/output system (BIOS) process to initialize hardware of the electronic device upon a first start up. The processor determines, within the BIOS process, that initialization of an operating system (OS) on the electronic device has not been performed. The processor waits to receive a user input indicating that the user is ready to initialize the OS, thus protecting the OS initialization process from unintended interruptions such as power loss that can cause the OS initialization to fail irreparably. Upon receiving the user input, the processor begins the OS initialization.
    Type: Application
    Filed: August 10, 2022
    Publication date: May 11, 2023
    Applicant: Schweitzer Engineering Laboratories, Inc.
    Inventors: Ian Olson, Huba Leidenfrost, John D. Prestwich, Ryan Lowell Hendrickson, Jennice Rinderknecht, Aaron Taylor
  • Publication number: 20130000871
    Abstract: According to various embodiments, an electronic component, such as a processor, is thermally coupled to a heat sink via a heat pipe. The heat pipe may contain a working fluid configured to freeze below a threshold temperature corresponding to the minimum operating temperature of the electronic component. Accordingly, if the temperature of the electronic component and/or the working fluid is below the threshold temperature, then the working fluid freezes, decreasing the amount of thermal energy transferred from the electronic component to the heat sink. The electronic component may self-heat until it is at least above the threshold temperature. Above the threshold temperature, the working fluid is in a fluid phase and increases the amount of thermal energy transferred from the electronic component to the heat sink via the heat pipe, and thereby reducing the temperature of the electronic component.
    Type: Application
    Filed: June 30, 2011
    Publication date: January 3, 2013
    Inventors: Ian Olson, Jerry J. Bennett, Timothy Ecklund, Gerald K. Hein