Abstract: The present invention discloses a semiconductor-on-diamond-on-carrier substrate wafer. The semiconductor-on-diamond-on-carrier wafer comprises: a semiconductor-on-diamond wafer having a diamond side and semiconductor side; a carrier substrate disposed on the diamond side of the semiconductor-on-diamond wafer and including at least one layer having a lower coefficient of thermal expansion (CTE) than diamond; and an adhesive layer disposed between the diamond side of the semiconductor-on-diamond wafer and the carrier substrate to bond the carrier substrate to the semiconductor-on-diamond wafer. The semiconductor-on-diamond-on-carrier substrate wafer has the following characteristics: a total thickness variation of no more than 40 ?m; a wafer bow of no more than 100 ?m; and a wafer warp of no more than 40 ?m.

Abstract: The present invention discloses a semiconductor-on-diamond-on-carrier substrate wafer. The semiconductor-on-diamond-on-carrier wafer comprises: a semiconductor-on-diamond wafer having a diamond side and semiconductor side; a carrier substrate disposed on the diamond side of the semiconductor-on-diamond wafer and including at least one layer having a lower coefficient of thermal expansion (CTE) than diamond; and an adhesive layer disposed between the diamond side of the semiconductor-on-diamond wafer and the carrier substrate to bond the carrier substrate to the semiconductor-on-diamond wafer. The semiconductor-on-diamond-on-carrier substrate wafer has the following characteristics: a total thickness variation of no more than 40 ?m; a wafer bow of no more than 100 ?m; and a wafer warp of no more than 40 ?m.

Abstract: A skeleton support has a concave shape configured to fit around a nose and mouth of a user. The support includes a skeletal structure that defines a plurality of connecting regions which form a first common connection interface. A cover includes a mounting mechanism with a plurality of fastening units which form a second common connection interface corresponding to the first common connection interface. Each fastening unit is configured to removably engage a corresponding connecting region of the skeleton support to hold the cover together with the skeleton support and form a mask. Different skeleton supports or covers with a different size, shape, color, pattern, flexibility, or material that also include the corresponding common connection interface can be swapped out to adjust the mask.

Abstract: The present invention discloses a semiconductor-on-diamond-on-carrier substrate wafer (55). The semiconductor-on-diamond-on-carrier wafer (55) comprises: a semiconductor-on-diamond wafer (40) having a diamond side and semiconductor side; a carrier substrate (50) disposed on the diamond side of the semiconductor-on-diamond wafer (40) and including at least one layer having a lower coefficient of thermal expansion (CTE) than diamond; and an adhesive layer (48) disposed between the diamond side of the semiconductor-on-diamond wafer (40) and the carrier substrate (50) to bond the carrier substrate (50) to the semiconductor-on-diamond wafer (40). The semiconductor-on-diamond-on-carrier substrate wafer (55) has the following characteristics: a total thickness variation of no more than 40 ?m; a wafer bow of no more than 100 ?m; and a wafer warp of no more than 40 ?m.

Abstract: A rotary rheometer is disclosed that includes improved control logic. This logic can provide continuously sampled force control logic, compliance control logic, adaptive control logic, anti-windup logic, and/or inertial correction logic.

Abstract: A skeleton support has a concave shape configured to fit around a nose and mouth of a user. The support includes a skeletal structure that defines a plurality of connecting regions which form a first common connection interface. A cover includes a mounting mechanism with a plurality of fastening units which form a second common connection interface corresponding to the first common connection interface. Each fastening unit is configured to removably engage a corresponding connecting region of the skeleton support to hold the cover together with the skeleton support and form a mask. Different skeleton supports or covers with a different size, shape, color, pattern, flexibility, or material that also include the corresponding common connection interface can be swapped out to adjust the mask.

Abstract: A rotary rheometer is disclosed that includes improved control logic. This logic can provide continuously sampled force control logic, compliance control logic, adaptive control logic, anti-windup logic, and/or inertial correction logic.

Abstract: A process for the manufacture of a lactam from an amino alkane nitrile and/or its hydrolysis derivatives, comprising reacting a solution comprising at least about 5% by weight amino alkane nitrile in water at a temperature of greater than or equal to about 350° C. and at a pressure of greater than about 250 bar. Optionally, a dilute acid may be added as a catalyst.

Abstract: A process for the manufacture of a lactam from an amino alkane nitrile and/or its hydrolysis derivatives, comprising reacting a solution comprising at least about 5% by weight amino alkane nitrile in water at a temperature of greater than or equal to about 350° C. and at a pressure of greater than about 250 bar. Optionally, a dilute acid may be added as a catalyst.

Abstract: A mobile telephone capable of being powered both by an internal power source and by an external power source, includes relay means operable to cause the telephone to relay signals between a base station and another mobile telephone, the relay means being operable only when an external power source is connected and not when it is running off its own internal battery.

Abstract: A vacuum sputtering apparatus (1) is described in which a target (7) having a target face (8) is mounted in a vacuum chamber (2) opposite a substrate (15). A magnetic pole plate (16) having a non-magnetic carrier plate (17) attached thereto is mounted behind the target (7) on a shaft (28) and can be rotated by means of a motor (29) about an axis substantially orthogonal to the target face (8). Carrier plate (17) has an array of holes (19) each of which can receive a corresponding first bar magnet (20, 21). There are fewer magnets (20, 21) than there are holes (19) and the magnets (20, 21) are removable from their holes (19). Carrier plate (17) also has a circumferential line of holes (22), in each of which may be mounted a corresponding second bar magnet (23). By varying the number and positions of the bar magnets (20, 21, 23) in the holes (19, 22) a variety of different high density plasma zone shapes (24; 25, 26; 27; 28) can be produced upon the target face (8).