Abstract: A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.

Abstract: A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.

Abstract: A wafer processing system according to one embodiment includes a chamber housing having an exhaust and a rotatable wafer support member for supporting a wafer. A filter fan unit is contained internally within the chamber housing and includes a variable speed fan. A controller is in communication with the variable speed fan to allow the housing to be maintained at either a net positive pressure or a net negative pressure relative to a surrounding environment (e.g., the clean room) outside the housing and also the relative pressures of the chamber housing, the surrounding environment and a handler area can be monitored and controlled.