Abstract: During fabrication of a perpendicular write head in a wafer, at least two sides of a write pole are defined (e.g. by ion milling) while a third side of the write pole is protected by a masking material. At this stage, a material that is to be located in the write gap is already present between the write pole and the masking material. After definition of the write pole surfaces, a layer of dielectric material is deposited. During this deposition, the masking material is still present. Thereafter, the masking material (and any dielectric material thereon) is removed, to form a hole in the dielectric material. Next, a trailing shield is formed in the structure, so that at least one portion of the trailing shield is located in the hole, and another portion of the trailing shield is located over the dielectric material, in an area adjacent to the hole. Note that the gap material is now sandwiched between the portion of the trailing shield in the hole, and the write pole.

Abstract: A method for forming a perpendicular magnetic recording head using an air-bearing surface damascene process and perpendicular magnetic recording head formed thereby is disclosed. The perpendicular head is formed by depositing a pseudo trailing shield layer over a pole layer and selectively etching the pseudo trailing shield layer to a depth equal to a desired trailing shield throat height. Then, a magnetic material is deposited in the resulting void.

Abstract: A magnetic write head for use in perpendicular magnetic data recording. The write head includes a write pole and a trailing shield having a tapered surface. A return pole stitched to the trailing shield is magnetically connected with the write pole at a location away from the air bearing surface (ABS).

Abstract: UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.

Abstract: The present invention provides a method of manufacturing a magnetoresistive read head which reduces electrostatic discharge and allows measurement of gap resistances in the head.

Abstract: A method of forming a read sensor that has a very narrow track width is disclosed. The method involves forming a thin lift-off mask over a central region of a sensor layer, which is subsequently ion-milled and deposited with hard bias and lead layers. The thin lift-off mask is made by forming a release layer over the sensor layer; forming a hardmask layer over the release layer; forming a photoresist layer over the hardmask layer; imaging and developing the photoresist layer such that end portions of the photoresist layer are removed and a central portion of the photoresist layer remains; reactive ion etching (RIE) the hardmask layer such that end portions of the hardmask layer are removed and a central portion of the hardmask layer remains; stripping the central portion of the photoresist layer; and etching the release layer such that end portions of the release layer are removed and a central portion of the release layer remains.

Abstract: A first read gap layer has a resistance RG1 between a first shield layer and one of the first and second lead layers of a read head and the second read gap layer has a resistance RG2 between a second shield layer and said one of the first and second lead layers of the read head. A connection is provided via a plurality of resistors between a first node and each of the first and second shield layers wherein the plurality of resistors includes at least first and second resistors RS1 and RS2 and the first node is connected to said one of the first and second lead layers. A second node is located between the first and second resistors RS1 and RS2. An operational amplifier has first and second inputs connected to the first and second nodes respectively so as to be across the first resistor RS1 and has an output connected to the first node for maintaining the first and second nodes at a common voltage potential. In a first embodiment the first and second shield layers are shorted together.

Abstract: A first read gap layer has a resistance RG1 between a first shield layer and one of the first and second lead layers of a read head and the second read gap layer has a resistance RG2 between a second shield layer and said one of the first and second lead layers of the read head. A connection is provided via a plurality of resistors between a first node and each of the first and second shield layers wherein the plurality of resistors includes at least first and second resistors RS1 and RS2 and the first node is connected to said one of the first and second lead layers. A second node is located between the first and second resistors RS1 and RS2. An operational amplifier has first and second inputs connected to the first and second nodes respectively so as to be across the first resistor RS1 and has an output connected to the first node for maintaining the first and second nodes at a common voltage potential. In a first embodiment the first and second shield layers are shorted together.

Abstract: A method of forming a read sensor that has a very narrow track width is disclosed. The method involves forming a thin lift-off mask over a central region of a sensor layer, which is subsequently ion-milled and deposited with hard bias and lead layers. The thin lift-off mask is made by forming a release layer over the sensor layer; forming a hardmask layer over the release layer; forming a photoresist layer over the hardmask layer; imaging and developing the photoresist layer such that end portions of the photoresist layer are removed and a central portion of the photoresist layer remains; reactive ion etching (RIE) the hardmask layer such that end portions of the hardmask layer are removed and a central portion of the hardmask layer remains; stripping the central portion of the photoresist layer; and etching the release layer such that end portions of the release layer are removed and a central portion of the release layer remains.

Abstract: A first read gap layer has a resistance RG1 between a first shield layer and one of the first and second lead layers of a read head and the second read gap layer has a resistance RG2 between a second shield layer and said one of the first and second lead layers of the read head. A connection is provided via a plurality of resistors between a first node and each of the first and second shield layers wherein the plurality of resistors includes at least first and second resistors RS1 and RS2 and the first node is connected to said one of the first and second lead layers. A second node is located between the first and second resistors RS1 and RS2. An operational amplifier has first and second inputs connected to the first and second nodes respectively so as to be across the first resistor RS1 and has an output connected to the first node for maintaining the first and second nodes at a common voltage potential. In a first embodiment the first and second shield layers are shorted together.

Abstract: A rotary microactuator includes a stationary electrode formed on a substrate, a movable electrode in proximity to the stationary electrode, a flexure mechanically connecting the stationary electrode to the movable electrode, and a plurality of limiters anchored to the substrate. Each limiter has an in-plane limiter portion and an out-of-plane limiter portion. The in-plane limiter portion limits movement of the movable electrode to a predetermined in-plane distance in a direction parallel to a surface of the substrate. The out-of-plane limiter portion limits movement of the movement of the movable electrode to a predetermined out-of-plane distance.