Patents by Inventor Ian Sakari Niemi

Ian Sakari Niemi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board with dielectric material sections having different dissipation factors
    Patent number: 8716603
    Abstract: An apparatus including a first printed wiring board section and a second printed wiring board section. The first printed wiring board section includes a first dielectric material layer. The first dielectric material layer has a first dissipation factor. The second printed wiring board section is directly attached with the first printed wiring board section to form a unitary printed wiring board structure. The second printed wiring board section includes a second dielectric material layer and an antenna on the second dielectric material layer. The second dielectric material layer has a different second dissipation factor.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: May 6, 2014
    Assignee: Nokia Corporation
    Inventors: Ian Sakari Niemi, Ilkka Johannes Kartio, Kimmo Markus Perala, Kari Viljo Jalmari Virtanen, Hannu Vaino Kalevi Ventomaki
  • Integrated antenna with e-flex technology
    Patent number: 8344955
    Abstract: A first printed wiring board PWB includes a core and a power layer and a ground layer. A second PWB includes a flexible portion that is partially embedded within an end section of the first printed wiring board and abutting the core. The flexible portion includes a first layer having an antenna feed coupled to the power layer of the core, and a second layer. In a particular embodiment, the second PWB also includes a rigid section in which an opposed end of the flexible portion is also partially embedded.
    Type: Grant
    Filed: January 8, 2010
    Date of Patent: January 1, 2013
    Assignee: Nokia Corporation
    Inventor: Ian Sakari Niemi
  • Integrated antenna with e-flex technology
    Publication number: 20110169698
    Abstract: A first printed wiring board PWB includes a core and a power layer and a ground layer. A second PWB includes a flexible portion that is partially embedded within an end section of the first printed wiring board and abutting the core. The flexible portion includes a first layer having an antenna feed coupled to the power layer of the core, and a second layer. In a particular embodiment, the second PWB also includes a rigid section in which an opposed end of the flexible portion is also partially embedded.
    Type: Application
    Filed: January 8, 2010
    Publication date: July 14, 2011
    Inventor: Ian Sakari Niemi