Patents by Inventor Ian Seth LADNER

Ian Seth LADNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220329048
    Abstract: The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.
    Type: Application
    Filed: April 9, 2021
    Publication date: October 13, 2022
    Inventors: Jack KOTOVSKY, Salmaan H. BAXAMUSA, Clint D. FRYE, Ian Seth LADNER, Thomas M. SPINKA, Devin Joseph FUNARO, David Ryan HOBBY, Caleb Del ANDERSON, Todd BANDHAUER
  • Publication number: 20220221670
    Abstract: The present disclosure relates to a monolithic waveguide substrate for enabling routing of at least one optical signal. The monolithic waveguide substrate has a monolithic engineered substrate having a uniform material composition throughout, with a first index of refraction, and with a plurality of three-dimensional waveguides each being formed fully within an interior volume thereof by a corresponding plurality of three-dimensional waveguide channels. The three-dimensional waveguide channels are formed by wall portions each having a second index of refraction different from the first index of refraction.
    Type: Application
    Filed: January 28, 2022
    Publication date: July 14, 2022
    Inventors: Susant K. PATRA, Razi-Ul Muhammad HAQUE, Komal KAMPASI, Ian Seth LADNER
  • Patent number: 11262514
    Abstract: The present disclosure relates to a hybrid opto-electrical module apparatus. The apparatus may have a module substrate having a plurality of electrically conductive circuit traces for carrying electrical signals, and at least one waveguide element for carrying optical signals. A waveguide substrate is in optical communication with the waveguide element. A transducer is supported on the waveguide substrate and in electrical communication with the circuit traces. The waveguide substrate has at least one three dimensional (3D) waveguide formed within its interior volume for routing optical signals between the waveguide element and the transducer. A first optical wirebond interfaces the waveguide element to the 3D waveguide, and a second optical wirebond interfaces the 3D waveguide to the transducer.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 1, 2022
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Susant Patra, Razi-Ul Muhammad Haque, Komal Kampasi, Ian Seth Ladner
  • Patent number: 11228294
    Abstract: A method of manufacturing a nanoelectromechanical resonator allows for uniform tuning of a resonant frequency. The nanoelectromechanical resonator can be mass produced and used to sense the presence of a selected gas.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: January 18, 2022
    Assignee: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
    Inventors: Michael Cullinan, Joon-Hyung Cho, David Cayll, Ian Seth Ladner
  • Publication number: 20210173160
    Abstract: The present disclosure relates to a hybrid opto-electrical module apparatus. The apparatus may have a module substrate having a plurality of electrically conductive circuit traces for carrying electrical signals, and at least one waveguide element for carrying optical signals. A waveguide substrate is in optical communication with the waveguide element. A transducer is supported on the waveguide substrate and in electrical communication with the circuit traces. The waveguide substrate has at least one three dimensional (3D) waveguide formed within its interior volume for routing optical signals between the waveguide element and the transducer. A first optical wirebond interfaces the waveguide element to the 3D waveguide, and a second optical wirebond interfaces the 3D waveguide to the transducer.
    Type: Application
    Filed: December 9, 2019
    Publication date: June 10, 2021
    Inventors: Susant PATRA, Razi-Ul Muhammad HAQUE, Komal KAMPASI, Ian Seth LADNER
  • Patent number: 10451539
    Abstract: This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: October 22, 2019
    Assignees: Lawrence Livermore National Security, LLC, Board of Regents, The University of Texas System
    Inventors: Sourabh Saha, Robert Matthew Panas, Michael A. Cullinan, Ian Seth Ladner
  • Publication number: 20190271635
    Abstract: This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.
    Type: Application
    Filed: March 2, 2018
    Publication date: September 5, 2019
    Inventors: Sourabh SAHA, Robert PANAS, Michael A. CULLINAN, Ian Seth LADNER