Abstract: A system including a database configured to store data characterizing a plurality of emails, a plurality of projects, a plurality of vendors, and a plurality of invoices. Each invoice of the plurality of invoices includes data characterizing a project of the plurality of projects, a vendor of the plurality of vendors, and a plurality of invoice data. The system also includes a computing system communicatively coupled to the database and including at least one processor. The at least one processor is configured to receive a file in a first format, convert the file into a second format, determine a first project, a first vendor, and a first plurality of invoice data based on data in the file, prepare a new invoice based on the first project, the first vendor, and the first plurality of invoice data determined, and provide the new invoice in a third format.

Abstract: Venture capital is not what software company startups require to create a software company. Software is what is required. This business method patent outlines how software can be used as capital in the place of and replacing the use of cash as capital for software startup companies. This business method invention also depicts a strategy for how single contributor software engineers can diversify their contributions as investments in several technological startup ventures, whereas until now software engineers have been limited to being sole contributors. This business method has the intended outcome of also increasing the rate at which a new software company can be brought to market and sold.

Abstract: The present invention relates to a method and apparatus for tracking position of an object in a multipath environment (for example, inside a building) using radio signals. In order to provide an accurate Time of Arrival (TOA) estimate in a multipath environment, a wide bandwidth signal (providing a sharp rise time pulse) is required. Only a limited bandwidth is available in the radio spectrum, however. Further, installations for position tracking which generate wide bandwidth signals require expensive and complex radios. In the present invention, a number of narrow bandwidth signals are generated by a transmitter and combined together at a receiver to provide an effective wideband position location signal. Only relatively narrow bandwidth signals have to be transmitted, therefore, but accurate position can still be determined. Further, transmission of narrow bandwidth signals enables the use of relatively inexpensive radio transmitters.

Abstract: A method of determining the position of a plurality of a radio transmitter units relative to a master unit is disclosed in which a control signal is provided from the master unit commanding each of the radio transmitter units to transmit a test signal and the remaining units to receive. The arrival times of the test signals are measured at the receiving radio transmitter units, and the position of each radio transmitter unit relative to the master unit is calculated solely on the basis of the measured arrival times, and an approximate initial position for each unit.

Abstract: A device for encoding a datum, the device being operable to encode the datum by effecting a phase difference between one or more first pseudorandom signals and one or more corresponding second pseudorandom signals.

Abstract: A method of tracking a human or animal is disclosed. A mobile unit is carried by the human or animal, the mobile unit including at least one inertial sensor and a radio transmitter for transmitting data from the mobile unit to a base station. The output data of the inertial sensor is used to count the number of steps taken by the human or animal, and the position of the human or animal is predicted based on the number of steps taken and step length data for the human or animal.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A processor and method for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

Abstract: A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A processor for rinsing and drying of semiconductor substrates includes a process vessel contained within an outer containment vessel. A diluted organic vapor creates a Marangoni effect flow along the surface of processing liquid contained within the process vessel. The process vessel includes porous walls that allow residual chemicals, organic species, and other unwanted materials to flow from the process vessel to the outer containment vessel. The porous walls allow for the maintenance of a stable surface tension gradient to sustain a consistent Marangoni force for even drying. Replacement processing fluid is preferably introduced to the process vessel to prevent the build up of organic species in the surface layer of the processing fluid.

Abstract: A method and apparatus for cleaning organic material from a semiconductor substrate suppresses the oxidation of a conductive film or layer on the substrate. A semiconductor substrate is immersed within a bath of water. The conductive layer is contacted to a source of electrons. The electrons form a floating charge protecting the conductive layer from oxidation. Ozone gas is introduced into the water bath. In another aspect, the semiconductor substrate is sprayed with water. Organic contaminants or films are oxidized and removed by the ozone, while the conductive or metal layer is preserved. An anode may be placed adjacent to the surface of the semiconductor substrate to passivate the metal layer via current flow.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.

Abstract: A method and apparatus for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.