Patents by Inventor Ian Sturland
Ian Sturland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250053083Abstract: A method and apparatus for the etching of variable depth features in a substrate is described. Movement of the substrate relative to an etchant (e.g. into or out of the etchant) during the etching process is utilised to provide a varying etch time, and hence depth, across the substrate, and in various examples this is enabled without requiring a varying mask.Type: ApplicationFiled: October 30, 2024Publication date: February 13, 2025Inventors: Ian Sturland, Mark Venables, Tracey Hawke, Rory Mills, Ian Macken
-
Patent number: 12169359Abstract: A method and apparatus for the etching of variable depth features in a substrate is described. Movement of the substrate relative to an etchant (e.g. into or out of the etchant) during the etching process is utilised to provide a varying etch time, and hence depth, across the substrate, and in various examples this is enabled without requiring a varying mask.Type: GrantFiled: August 20, 2020Date of Patent: December 17, 2024Assignee: Snap Inc.Inventors: Ian Sturland, Mark Venables, Tracey Hawke, Rory Mills, Ian Macken
-
Publication number: 20220342297Abstract: A method and apparatus for the etching of variable depth features in a substrate is described. Movement of the substrate relative to an etchant (e.g. into or out of the etchant) during the etching process is utilised to provide a varying etch time, and hence depth, across the substrate, and in various examples this is enabled without requiring a varying mask.Type: ApplicationFiled: August 20, 2020Publication date: October 27, 2022Applicant: BAE SYSTEMS plcInventors: Ian Sturland, Mark Venables, Tracey Hawke, Rory Mills, Ian Macken
-
Patent number: 9656858Abstract: A method of reactive ion etching a substrate 46 to form at least a first and a second etched feature (42, 44) is disclosed. The first etched feature (42) has a greater aspect ratio (depth:width) than the second etched feature (44). In a first etching stage the substrate (46) is etched so as to etch only said first feature (42) to a predetermined depth. Thereafter in a second etching stage, the substrate (46) is etched so as to etch both said first and said second features (42, 44) to a respective depth. A mask (40) may be applied to define apertures corresponding in shape to the features (42, 44). The region of the substrate (46) in which the second etched feature (44) is to be produced is selectively masked with a second maskant (50) during the first etching stage, The second maskant (50) is then removed prior to the second etching stage.Type: GrantFiled: July 21, 2014Date of Patent: May 23, 2017Assignee: ATLANTIC INERTIAL SYSTEMS LIMITEDInventors: Tracey Hawke, Mark Venables, Ian Sturland, Rebecka Eley
-
Patent number: 7637156Abstract: A vibrator 10, which is formed in a silicon wafer 1 by means of MEMS technique, has eight beam portions (beams) 12 supported at a central portion 11 and extending in the radial direction while mutually keeping the same angle and has a ring portion 13 connected to the eight beam portions 12. Outside the ring portion 13, eight electrodes 21a to 21h for electrostatic actuation, capacitance detection, or the like are spaced uniformly with a gap 22 created between the ring portion 13 and the electrodes 21a to 21h. Inside the ring portion 13, sixteen electrodes 23 for frequency adjustment are spaced uniformly with a gap 24 created between the ring portion 13 and the electrodes 23.Type: GrantFiled: July 12, 2005Date of Patent: December 29, 2009Assignees: Sumitomo Precision Products, Atlantic Inertial Systems LimitedInventors: Ryuta Araki, Osamu Torayashiki, Toru Kitamura, Hiroshi Kawasaki, Tsuyoshi Takemoto, Koji Nakamura, Christopher P. Fell, Kevin Townsend, Ian Sturland
-
Publication number: 20070220972Abstract: A vibrator 10, which is formed in a silicon wafer 1 by means of MEMS technique, has eight beam portions (beams) 12 supported at a central portion 11 and extending in the radial direction while mutually keeping the same angle and has a ring portion 13 connected to the eight beam portions 12. Outside the ring portion 13, eight electrodes 21a to 21h for electrostatic actuation, capacitance detection, or the like are spaced uniformly with a gap 22 created between the ring portion 13 and the electrodes 21a to 21h. Inside the ring portion 13, sixteen electrodes 23 for frequency adjustment are spaced uniformly with a gap 24 created between the ring portion 13 and the electrodes 23.Type: ApplicationFiled: July 12, 2005Publication date: September 27, 2007Applicant: BAE STSTEMS PLCInventors: Ryuta Araki, Osamu Torayashiki, Toru Kitamura, Hiroshi Kawasaki, Tsuyoshi Takemoto, Koji Nakamura, Christopher Fell, Kevin Townsend, Ian Sturland
-
Publication number: 20070205142Abstract: A separator is disclosed for separating particles of at least first and second mass/size ranges from an ambient fluid (e.g. gaseous) medium in which they are present, particles of the first range being of generally larger size/mass than particles of the second range. The separator is especially designed for use in an air monitoring device which is designed for rapid detection of micro-organisms such as bacteria, viruses, pathogens and the like, and is designed to be portable so that it can be readily and rapidly deployed in both civilian and military environments and can be used indoors and outdoors; it can also be designed for personal use.Type: ApplicationFiled: September 9, 2005Publication date: September 6, 2007Applicant: BAE SYSTEMS picInventors: Alexander Parfitt, Ian Sturland, Clyde Warsop, Paul Dawson
-
Publication number: 20060162431Abstract: A microsensor for detecting corrosive media acting on a bulk metallic material when mounted in situ adjacent a location in the bulk metallic material. The microsensor includes a plurality of corrosion sensors (4A, 4B, 4C) exposed to the corrosive media, each having corrosive tracks formed from a patterned conductive thin film. The different sensors have different characteristics, such as track width, track thickness, track composition, surface type, sensor type, etc. so as to provide the sensors with different sensitivities, corrosion indications and lifetime characteristics. Such microsensor arrangements provide improved corrosion detection at high degrees of miniaturisation.Type: ApplicationFiled: September 30, 2003Publication date: July 27, 2006Inventors: Steven Harris, Michael Hebbron, Ian Sturland
-
Publication number: 20060002815Abstract: A microsensor for detecting corrosive media acting on a bulk metallic material when mounted in situ adjacent a location in the bulk metallic material. The microsensor includes a plurality of corrosive tracks (16; 132; 216B) exposed to the corrosive media, each said corrosive track being formed as a patterned conductive thin film track. The tracks follow serpentine paths which include a plurality of bends, at least two of which are of opposite curvature, to provide a high degree of miniaturisation coupled with accurate and reliable corrosion sensing characteristics. The corrosive tracks may be formed from an alloy material, such as an aluminium alloy, to mimic the corrosive characteristics of a bulk metallic alloy and to provide improved corrosion detection for components made from such materials at high degrees of miniaturisation.Type: ApplicationFiled: October 1, 2003Publication date: January 5, 2006Inventors: Steven Harris, Michael Hebbron, Ian Sturland
-
Patent number: 6471883Abstract: A vibrating structure gyroscope having a silicon substantially planar ring vibrating structure (1) capacitive means for imparting drive motion to and sensing motion of the vibrating structure (1), and a screen layer (15) surrounding the capacitive means is made by depositing photoresist material (9) on a glass or silicon substrate (7), hardening, patterning and developing the photoresist (9) to expose areas of the substrate (7), etching the exposed areas to form cavities (10) therein, stripping any remaining photoresist material (9) attaching a silicon layer (8) to the cavitated substrate (7) depositing a layer of aluminium on the silicon layer (8), depositing photoresist material on the aluminium layer, hardening, patterning and developing the photoresist layer to expose areas of the aluminium layer, etching the exposed areas of the aluminium layer to leave regions of aluminium on the silicon layer providing bond pads (11, 12, 13 and 14), stripping the remaining photoresist from the aluminium layer, depositiType: GrantFiled: December 22, 1999Date of Patent: October 29, 2002Assignee: BAE Systems PLCInventors: Christopher P Fell, Kevin Townsend, Ian Sturland