Patents by Inventor Ian Winfield

Ian Winfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250230568
    Abstract: A method of making a heatsink includes positioning a cathode, which includes a build plate and a metallic foil supported on the build plate, into an electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution, connecting the metallic foil to a power source, and connecting one or more deposition anodes of the deposition anode array to the power source. The method further includes transmitting electrical energy from the power source through the one or more deposition anodes, through the electrolyte solution, and to the metallic foil, such that material is deposited onto the metallic foil and forms at least a portion of a heat exchange feature of a heatsink. The heatsink includes the metallic foil and the material deposited onto the metallic foil.
    Type: Application
    Filed: October 10, 2024
    Publication date: July 17, 2025
    Inventors: Ian Winfield, Charles Biset, Tim Ouradnik, Joseph Workman
  • Publication number: 20250163598
    Abstract: An electrochemical additive manufacturing method includes positioning a cathode portion of a build plate and a deposition anode array into an electrolyte solution. The method additionally includes transmitting electrical energy from the power source through one or more deposition anodes, through the electrolyte solution, and to the cathode portion such that material is deposited onto the cathode portion. The build plate includes a thermal feature, the deposited material is thermally coupled with the thermal feature, and the deposited material forms a heat wicking feature.
    Type: Application
    Filed: January 9, 2025
    Publication date: May 22, 2025
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros
  • Patent number: 12227862
    Abstract: An electrochemical additive manufacturing method includes positioning a cathode portion of a build plate and a deposition anode array into an electrolyte solution. The method additionally includes transmitting electrical energy from the power source through one or more deposition anodes, through the electrolyte solution, and to the cathode portion such that material is deposited onto the cathode portion. The build plate includes a thermal feature, the deposited material is thermally coupled with the thermal feature, and the deposited material forms a heat wicking feature.
    Type: Grant
    Filed: February 21, 2024
    Date of Patent: February 18, 2025
    Assignee: FABRIC8LABS, INC.
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros
  • Publication number: 20240271304
    Abstract: An electrochemical additive manufacturing method includes positioning a cathode portion of a build plate and a deposition anode array into an electrolyte solution. The method additionally includes transmitting electrical energy from the power source through one or more deposition anodes, through the electrolyte solution, and to the cathode portion such that material is deposited onto the cathode portion. The build plate includes a thermal feature, the deposited material is thermally coupled with the thermal feature, and the deposited material forms a heat wicking feature.
    Type: Application
    Filed: February 21, 2024
    Publication date: August 15, 2024
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros
  • Patent number: 11920251
    Abstract: An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: March 5, 2024
    Assignee: FABRIC8LABS, INC.
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros
  • Publication number: 20230070048
    Abstract: An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 9, 2023
    Inventors: David Pain, Ian Winfield, Andrew Edmonds, Kareem Shaik, Jeffrey Herman, Michael Matthews, Charles Pateros