Abstract: Embodiments described herein may provide an acoustic wave device, a method of fabricating an acoustic wave device, and a system incorporating an acoustic wave device. The acoustic wave device may include a transducer disposed on a substrate, with a contact coupled with the transducer. The acoustic wave device may further include a wall layer and cap that define an enclosed opening around the transducer. A via may be disposed through the cap and wall layer over the contact, and a top metal may be disposed in the via. The top metal may form a pillar in the via and a pad on the cap above the via. The pillar may provide an electrical connection between the pad and the contact. In some embodiments, the acoustic wave device may be formed as a wafer-level package on a substrate wafer.

Abstract: A plate-based microelectromechanical system (MEMS) switch is provided which includes a moveable plate suspended above a substrate and a plurality of arms extending from the periphery of the moveable plate. The moveable plate includes a first electrode suspended over a second electrode arranged on the substrate and a first input/output signal contact structure electrically isolated from the first electrode. In some embodiments, the first input/output signal contact structure is arranged proximate to the edge of the moveable plate. In addition or alternatively, one of the arms is electrically coupled to the first input/output signal contact structure and comprises an input/output signal trace. A cantilever-based MEMS switch is provided which includes a cantilever structure with a first electrode suspended a second electrode arranged upon a substrate.