Abstract: An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a flip-chip connection. The semiconductor component is flip-chip bonded at a pad array at a component side thereof to a pad array at a board side by way of an individual solder joint portion. In a solder resist layer at a semiconductor component side and a solder resist layer at a board side, D/D0 is prepared to be in a range of 0.70 to 0.99, where D is a bottom inner diameter of an opening at the board side and D0 is a bottom inner diameter of an opening at the component side.