Abstract: Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.

Abstract: The present invention generally relates to a tensile impact apparatus that is designed to give dynamic stress-strain curves and fracture characteristics for a rubber specimen undergoing tensile impact loading. More particularly, this invention relates to a tensile impact apparatus that is capable of achieving strains of up to fracture. The apparatus is also capable of visually recording fracture phenomena.

Abstract: A more reliable and easier to manufacture underfill assembly is shown. Underfill layers are shown that are manufacturable separately from an assembly operation. In one example, underfill layers have the ability for pick and place operations during assembly. Another advantage of underfill layers provided includes self aligning holes that aid in placing semiconductor chips over an appropriate location on a substrate. Another advantage of selected underfill layers includes pre-formed conductive plugs within an underfill layer that eliminate the need for forming solder bumps on an adjacent component surface.

Abstract: The present invention generally relates to a tensile impact apparatus that is designed to give dynamic stress-strain curves and fracture characteristics for a rubber specimen undergoing tensile impact loading. More particularly, this invention relates to a tensile impact apparatus that is capable of achieving strains of up to fracture. The apparatus is also capable of visually recording fracture phenomena.