Abstract: A method for transmitting a data block begins with segmenting the data block into a number of data sub-blocks. Each data sub-block where a number of high bits is greater than a number of low bits is then inverted. The data sub-blocks are then grouped into sets of data sub-blocks. For each set of data sub blocks, a number of pulses indicative of a number of high bits in each one of the data sub-blocks in the set is transmitted, there is a delay, and a number of pulses indicative of each high bit in each data sub-block of the set of data sub-blocks is transmitted followed by a delay. Finally, a number of pulses indicative of which ones of the data sub-blocks were inverted is transmitted.

Abstract: A method includes the steps of providing a number of force consolidators between an object and a surface, providing a number of force sensors, each in a different one of the force consolidators, measuring an output of the force sensors, and processing the output of the force sensors to determine a total force exerted between the object and the surface. The force consolidators are each configured to reduce a portion of a surface area of the object into a consolidated surface area such that forces exerted on the portion of the surface area are concentrated in the consolidated surface area. By using the force consolidators along with the force sensors, the total force exerted by the object on the surface may be easily measured using off-the-shelf force sensor technologies.

Abstract: A method for secure device-to-device communication using multilayered ciphers is provided. A selected cipher is employed to generate a pair of encryption/decryption keystreams for enabling multilayered encryption/decryption on a pulsed-index communication (PIC) packet(s). In examples discussed herein, a first layer encryption/decryption is performed by encrypting/decrypting a PIC data(s) (PD(s)) in the PIC packet(s) based on a first of the pair of encryption/decryption keystreams. In addition, a second layer encryption/decryption is performed by encrypting/decrypting selected control information (e.g., information related to encoding/decoding the PD(s)) in the PIC packet(s) based on a second of the pair of encryption/decryption keystreams.

Abstract: A method for estimating the weight of a subject while moving includes attaching one or more force sensors to the subject such that the force sensors measure a force exerted between each foot of the subject and a surface on which the subject is positioned, monitoring the one or more force sensors while the subject is moving to obtain a moving force measurement, processing the moving force measurement to determine a peak level of the moving force, a valley level of the moving force measurement, and a force range of the moving force measurement, determining an acceleration of center of mass of the subject from the force range, and estimating the weight of the subject while moving from the valley level and the acceleration of center of mass.

Abstract: A method for secure device-to-device communication using multilayered ciphers is provided. A selected cipher is employed to generate a pair of encryption/decryption keystreams for enabling multilayered encryption/decryption on a pulsed-index communication (PIC) packet(s). In examples discussed herein, a first layer encryption/decryption is performed by encrypting/decrypting a PIC data(s) (PD(s)) in the PIC packet(s) based on a first of the pair of encryption/decryption keystreams. In addition, a second layer encryption/decryption is performed by encrypting/decrypting selected control information (e.g., information related to encoding/decoding the PD(s)) in the PIC packet(s) based on a second of the pair of encryption/decryption keystreams.

Abstract: A method for transmitting a data block begins with segmenting the data block into a number of data sub-blocks. Each data sub-block where a number of high bits is greater than a number of low bits is then inverted. The data sub-blocks are then grouped into sets of data sub-blocks. For each set of data sub blocks, a number of pulses indicative of a number of high bits in each one of the data sub-blocks in the set is transmitted, there is a delay, and a number of pulses indicative of each high bit in each data sub-block of the set of data sub-blocks is transmitted followed by a delay. Finally, a number of pulses indicative of which ones of the data sub-blocks were inverted is transmitted.

Abstract: A method for estimating the weight of a subject while moving includes attaching one or more force sensors to the subject such that the force sensors measure a force exerted between each foot of the subject and a surface on which the subject is positioned, monitoring the one or more force sensors while the subject is moving to obtain a moving force measurement, processing the moving force measurement to determine a peak level of the moving force, a valley level of the moving force measurement, and a force range of the moving force measurement, determining an acceleration of center of mass of the subject from the force range, and estimating the weight of the subject while moving from the valley level and the acceleration of center of mass.

Abstract: A method includes the steps of providing a number of force consolidators between an object and a surface, providing a number of force sensors, each in a different one of the force consolidators, measuring an output of the force sensors, and processing the output of the force sensors to determine a total force exerted between the object and the surface. The force consolidators are each configured to reduce a portion of a surface area of the object into a consolidated surface area such that forces exerted on the portion of the surface area are concentrated in the consolidated surface area. By using the force consolidators along with the force sensors, the total force exerted by the object on the surface may be easily measured using off-the-shelf force sensor technologies.

Abstract: A design structure for a 3D chip having at least one I/O layer connected to other 3D chip layers by a vertical bus such that the I/O layer(s) may accommodate protection and off-chip device drive circuits, customization circuits, translation circuits, conversions circuits and/or built-in self-test circuits capable of comprehensive chip or wafer level testing wherein the I/O layers function as a testhead. Substitution of I/O circuits or structures may be performed using E-fuses or the like responsive to such testing.

Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

Abstract: The present disclosure describes a method and an apparatus for analyzing measured signals using various processing techniques. In certain embodiments, the measured signals are physiological signals. In certain embodiments, the measurements relate to blood constituent measurements including blood oxygen saturation.

Abstract: The present disclosure describes a method and an apparatus for analyzing measured signals using various processing techniques. In certain embodiments, the measured signals are physiological signals. In certain embodiments, the measurements relate to blood constituent measurements including blood oxygen saturation.

Abstract: The present disclosure describes a method and an apparatus for analyzing measured signals using various processing techniques. In certain embodiments, the measured signals are physiological signals. In certain embodiments, the measurements relate to blood constituent measurements including blood oxygen saturation.

Abstract: The present disclosure describes a method and an apparatus for analyzing measured signals using various processing techniques. In certain embodiments, the measured signals are physiological signals. In certain embodiments, the measurements relate to blood constituent measurements including blood oxygen saturation.

Abstract: A three dimensional (3D) integrated circuit (IC), 3D IC chip and method of fabricating a 3D IC chip. The chip includes multiple layers of circuits, e.g., silicon insulator (SOI) CMOS IC layers, each including circuit elements. The layers may be formed in parallel and one layer attached to another to form a laminated 3D chip.

Abstract: The present disclosure describes a method and an apparatus for analyzing measured signals using various processing techniques. In certain embodiments, the measured signals are physiological signals. In certain embodiments, the measurements relate to blood constituent measurements including blood oxygen saturation.

Abstract: The present invention involves a method and an apparatus for analyzing measured signals, including the determination of a measurement of correlation in the measured signals during a calculation of a physiological parameter of a monitored patient. Use of this invention is described in particular detail with respect to blood oximetry measurements.

Abstract: Methods and apparatus are provided for analyzing transmission lines with decoupling of connectors and other circuit elements. According to one aspect of the invention, circuits with one or more parasitic elements are analyzed by partitioning at least one of the parasitic elements in a transverse manner; identifying a plurality of subcircuits each comprised of partitioned circuit elements from the plurality of transmission lines and one or more parasitic elements in a given path; wherein each of the subcircuits is associated with a path in the circuit; performing a waveform relaxation analysis between each of the subcircuits; and repeating the step of performing the waveform relaxation analysis using waveforms determined in a previous iteration until convergence to a resultant waveform has occurred. The circuit can optionally further comprise one or more transmission lines which would also be partitioned in a transverse manner.

Abstract: Methods and apparatus are provided for predicting the number of iterations needed for a computed Transversal Waveform Relaxation solution to achieve a given level of accuracy. In this manner, a Transversal Waveform Relaxation algorithm is disclosed that provides full automation. According to one aspect of the invention, a circuit is analyzed having transmission lines. One or more transmission line parameters of the circuit are obtained, as well as the intrinsic behavior, E(?), and strength of coupling, N(?), of each of the transmission lines. In addition, a relative error bound is obtained for the circuit based on the intrinsic behavior, E(?), and strength of coupling, N(?), of the transmission lines and a predefined error threshold. The process then iterates until the relative error bound satisfies the error threshold.

Abstract: A 3D chip having at least one I/O layer connected to other 3D chip layers by a vertical bus such that the I/O layer(s) may accommodate protection and off-chip device drive circuits, customization circuits, translation circuits, conversions circuits and/or built-in self-test circuits capable of comprehensive chip or wafer level testing wherein the I/O layers function as a testhead. Substitution of I/O circuits or structures may be performed using E-fuses or the like responsive to such testing.