Patents by Inventor Ibrahim IA Atalmis

Ibrahim IA Atalmis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile drive unit for elevator system
    Patent number: 10071880
    Abstract: A drive unit for an elevator system, the drive unit including a multilayer, power circuit board; a first DC link formed in a layer of the power circuit board; a second DC link formed in a layer of the power circuit board; a first switch having a first terminal, the first switch mounted to a surface of the power circuit board; a first via electrically coupling the first terminal to the first DC link; a second switch having a second terminal, the second switch mounted to the surface of the power circuit board; and a second via electrically coupling the second terminal to the second DC link; the first via conducting heat from the first switch to the first DC link; the second via conducting heat from the second switch to the second DC link.
    Type: Grant
    Filed: February 21, 2013
    Date of Patent: September 11, 2018
    Assignee: OTIS ELEVATOR COMPANY
    Inventors: Andreas Tutat, Ibrahim Ia Atalmis, Herbert Horbrügger, Marvin Dehmlow
  • LOW PROFILE DRIVE UNIT FOR ELEVATOR SYSTEM
    Publication number: 20160039633
    Abstract: A drive unit for an elevator system, the drive unit including a multilayer, power circuit board; a first DC link formed in a layer of the power circuit board; a second DC link formed in a layer of the power circuit board; a first switch having a first terminal, the first switch mounted to a surface of the power circuit board; a first via electrically coupling the first terminal to the first DC link; a second switch having a second terminal, the second switch mounted to the surface of the power circuit board; and a second via electrically coupling the second terminal to the second DC link; the first via conducting heat from the first switch to the first DC link; the second via conducting heat from the second switch to the second DC link.
    Type: Application
    Filed: February 21, 2013
    Publication date: February 11, 2016
    Inventors: Andreas Tutat, Ibrahim IA Atalmis, Herbert Horbrügger, Marvin Dehmlow