Patents by Inventor Ibuki SHINKAI

Ibuki SHINKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METAL BOND GRINDSTONE FOR HARD AND BRITTLE MATERIAL
    Publication number: 20220048161
    Abstract: A metal bond grindstone grinds a hard and brittle material. The metal bond grindstone includes: a metal bond; abrasive grains bound by the metal bond; and pores having a pore size of 50-200 ?m, such that a porosity in an entirety of the metal bond grindstone is 50-65 vol %. A number of the abrasive grains on a grinding surface excluding the pores may be 700-6500 grains/cm2. The abrasive grains may be diamond abrasive grains, and a grain size of the abrasive grains may be 4-20 ?m in median size. The metal bond grindstone may have a grindstone strength of 40-95 MPa.
    Type: Application
    Filed: January 24, 2020
    Publication date: February 17, 2022
    Applicant: NORITAKE CO., LIMITED
    Inventors: Daiki FURUNO, Ibuki SHINKAI, Masaru YAMAGUCHI