Abstract: An LED lighting device includes: an LED module; a thermal base coupled with the LED module and configured to absorb heat; and a heat-pipe loop formed in a tubule shape and having working fluid injected thereinto and comprising a heat-absorption portion coupled with the thermal base and configured to absorb heat and a heat-dissipating portion configured to dissipate the heat absorbed by the heat-absorption portion, wherein each coil of the heat-pipe loop is formed in a thin and long shape, and one side of the thin-and-long coil is coupled to the thermal base, and the other side of the thin-and-long coil is protruded to an outside from an edge of the thermal base.

Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.