Abstract: An antenna device, for a mobile body, of this disclosure includes an antenna configured to be installed in the mobile body, and a reflector having a reflection surface configured to change a beam direction of the antenna.

Abstract: This invention relates to a device for removing fused slags on slabs wherein <-shaped cutters with the front center thereof being the apex are disposed on the front and rear positions of a tool rest being vertically movable with a required spacing and being close to the undersurface of the slab, respectively. At least the rear cutter is biased upwardly by a spring mounted in the lower portion of the tool rest. At the same time the shear point in the rear cutter is made to be somewhat higher than that of the front cutter in order to cut out the fused slags deposited on the undersurface of the slab on a transferring roller table with a prescribed length. If it is arranged in such a way that a water-cooling means for water-cooling the deposited portion of the fused dross is disposed before and behind the above device for removing fused slags on slabs, respectively, to cut off the cured dross, the fused slags can more effectively be removed.

Abstract: A fluorescent display device comprising a glass base plate fitted thereon with, as the main components, fluorescent material-coated segmentary electrodes, controlling grid electrodes and a cathode for emitting thermal electrons, and a glass panel fusion bonded to said glass base plate so as to cover said electrodes, the fusion bond being effected at much lower temperatures than before.

Abstract: A method of fabricating a thermal printing head by printing a circuit pattern of resistive elements and electric conductors on one surface of a flat paper sheet, covering the circuit pattern and surface of the flat paper sheet with a carrier layer of a substantially transparent methacrylic acid resin, peeling off the flat paper sheet, placing the remaining carrier layer carrying the circuit pattern over a surface of a pre-shaped insulating substrate with the circuit pattern being laid downward, and heating the carrier layer placed on the substrate to cause the carrier layer to be burned off and cause the circuit pattern to adhere to the surface of the substrate.