Abstract: A glass substrate for magnetic disks, obtained by chemical strengthening treatment of a glass consisting essentially of from 50 to 65 wt % of SiO.sub.2, from 5 to 15 wt % of Al.sub.2 O.sub.3, from 2 to 7 wt % of Na.sub.2 O, from 4 to 9 wt % of K.sub.2 O, from 7 to 14 wt % of Na.sub.2 O+K.sub.2 O, from 12 to 25 wt % of MgO+CaO+SrO+BaO, and from 1 to 6 wt % of ZrO.sub.2.

Abstract: To reduce occurrence of flaws in a polishing process by preventing an abrasive grain or metallic particles deposited on the surface of a glass substrate for a magnetic disk in a lapping process from entering into the subsequent polishing process. A lapping process for the main surface is a glass substrate for a magnetic disk is conducted; an etching process for the main surface of the glass substrate is conducted to the extent of a depth of 0.1 .mu.m to 3 .mu.m, followed by conducting a polishing process for the main surface of the glass substrate where the etching process has been conducted.

Abstract: A composite porous ceramic hollow fiber obtained by dipping a porous ceramic hollow fiber into a carbon precursor-forming solution, picking up and drying the dipped porous ceramic hollow fiber, heating the thus deposited carbon precursor-forming film, thereby obtaining a carbon precursor thin film, and heating the carbon precursor thin film at a carbon precursor thermal decomposition temperature, thereby forming a carbon thin film on the porous ceramic hollow fiber has a permeance about 100 to about 1,000 times as high as that of an organic thin film and a separation coefficient as high as that of the organic thin film.

Abstract: Provided are functional peptide fragments of human caldesmon having calmodulin and actin-binding activity, the amino acid sequences and nucleic acid sequences therefor.

Abstract: A glass substrate for a magnetic disk having an inner peripheral edge and an outer peripheral edge, wherein the surface of at least the inner peripheral edge is treated by etching to have a surface roughness such that, as measured by a three dimensional scanning electron microscope at randomly selected at least four places with a reference length of 240 .mu.m and a cut-off wavelength of arithmetic mean roughness (Ra) of 80 .mu.m, the mean value of arithmetic mean roughness (Ra) is from 1.0 to 6.0 .mu.m, and the mean value of the number of peaks is within a range of from 8 to 30.

Abstract: Provided are functional peptide fragments of human caldesmon having calmodulin and actin-binding activity, the amino acid sequences and nucleic acid sequences therefor.

Abstract: A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.

Abstract: A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.

Abstract: A semi-full cut semiconductor wafer is put on an adhesive sheet attached to a ring frame. Then, the semiconductor wafer is pushed upward from the back surface of the adhesive sheet by a rotatable breaking member in the shape of a disk the edge portion of which is triangular in section. In this state, the ring frame is moved so that the breaking member may not deviate from dicing lines, whereby the semiconductor wafer is divided into a large number of chips.