Patents by Inventor Ichiro Hazeyama
Ichiro Hazeyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210246284Abstract: Disclosed is a shaped article which comprises a thermoplastic alicyclic structure-containing resin. The shaped article comprises a spherulite having a size of less than 3 ?m and has a crystallinity of 20% or more and 70% or less.Type: ApplicationFiled: June 12, 2019Publication date: August 12, 2021Applicant: ZEON CORPORATIONInventor: Ichiro HAZEYAMA
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Patent number: 10896827Abstract: To provide a support for manufacturing semiconductor packages which has excellent durability in treatments such as polishing, heating, exposing/developing, plating, and vacuuming; a use of the support for manufacturing semiconductor packages; and a method of manufacturing semiconductor packages. The support includes a substrate layer and an adhesive layer adjacent to the substrate layer, wherein the substrate layer is formed of an alicyclic structure-containing resin film.Type: GrantFiled: June 19, 2017Date of Patent: January 19, 2021Assignee: ZEON CORPORATIONInventor: Ichiro Hazeyama
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Publication number: 20190148175Abstract: To provide a support for manufacturing semiconductor packages which has excellent durability in treatments such as polishing, heating, exposing/developing, plating, and vacuuming; a use of the support for manufacturing semiconductor packages; and a method of manufacturing semiconductor packages. The support includes a substrate layer and an adhesive layer adjacent to the substrate layer, wherein the substrate layer is formed of an alicyclic structure-containing resin film.Type: ApplicationFiled: June 19, 2017Publication date: May 16, 2019Applicant: ZEON CORPORATIONInventor: Ichiro HAZEYAMA
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Patent number: 9195327Abstract: The present invention provides a touch panel with features enabling the external form to be downsized without degrading a detection accuracy of a touch input area and applying an electric voltage to a pair of the electrodes and detecting the output electric voltages inverting the polarity of the voltage. A touch panel of the present invention uses the principle of Apollonius' circle for the touch position detection. Said touch panel is fabricated so that two substrates having a transparent conductive film thereon are place in a manner that said each transparent conductive film is facing each other. A first substrate has one electrode and a second substrate has two pairs of point electrodes. Said two pairs of the point electrodes are arranged in a circumference region of said second substrate.Type: GrantFiled: December 31, 2012Date of Patent: November 24, 2015Assignee: NLT TECHNOLOGIES, LTD.Inventors: Yukihiro Ito, Ichiro Hazeyama, Shizuo Morishita
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Publication number: 20130241850Abstract: [Problem] The present invention provides a touch panel with features enabling the external form to be downsized without degrading a detection accuracy of a touch input area and applying an electric voltage to a pair of the electrodes and detecting the output electric voltages inverting the polarity of the voltage. [Solution] A touch panel of the present invention uses the principle of Apollonius' circle for the touched position detection. Said touch panel is fabricated so that two substrates having a transparent conductive film thereon are placed in the manner that said each transparent conductive film is facing each other. A first substrate has one electrode and a second substrate has two pairs of point electrodes. Said two pairs of the point electrodes are arranged in a circumference region of said second substrate.Type: ApplicationFiled: December 31, 2012Publication date: September 19, 2013Applicant: NLT TECHNOLOGIES, LTD.Inventors: Yukihiro ITO, Ichiro HAZEYAMA, Shizuo MORISHITA
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Patent number: 7594644Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.Type: GrantFiled: November 7, 2005Date of Patent: September 29, 2009Assignee: NEC CorporationInventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
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Publication number: 20080266474Abstract: In a liquid crystal panel of the present invention, a common storage line is connected to a counter electrode by means of a conductive convex structure in a display area, and wiring resistance of the common storage line is made smaller than wiring resistance of a gate line. By making the wiring resistance of the common storage line smaller, a flicker and crosstalk can be reduced. Even in a large-sized liquid crystal panel, a liquid crystal panel having a good picture quality and a liquid crystal display using the same can be obtained.Type: ApplicationFiled: April 25, 2008Publication date: October 30, 2008Applicant: NEC LCD TECHNOLOGIES, LTD.Inventor: Ichiro Hazeyama
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Patent number: 7352069Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.Type: GrantFiled: December 24, 2003Date of Patent: April 1, 2008Assignees: Nitto Denko Corporation, NEC CorporationInventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro
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Patent number: 7230328Abstract: A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.Type: GrantFiled: November 19, 2003Date of Patent: June 12, 2007Assignee: NEC CorporationInventors: Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo
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Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
Patent number: 7119438Abstract: A method of arranging microspheres with liquid, a microsphere arranging device, and a semiconductor device are provided. The method comprising the steps of placing the semiconductor device with a large number of pads with holes, on a loading table with a variable tilt angle, and pouring microspheres together with conductive liquid held in a holding container onto the semiconductor device. The microspheres are storably placed in the holes on the pads of the semiconductor device. The non-stored microspheres and conductive liquid are accumulated in a receiving tank, and the conductive liquid including the accumulated microspheres are transferred to the holding container by a pump.Type: GrantFiled: January 10, 2003Date of Patent: October 10, 2006Assignees: NEC Corporation, Japan E M Co., Ltd.Inventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko, Hitoshi Anma, Tosiji Yamada, Akeo Katahira -
Publication number: 20060103028Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C) (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.Type: ApplicationFiled: December 24, 2003Publication date: May 18, 2006Applicants: NITTO DENKO CORPORATION, NEC CORPORATIONInventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro
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Publication number: 20060055053Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.Type: ApplicationFiled: November 7, 2005Publication date: March 16, 2006Inventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
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Publication number: 20060049495Abstract: A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.Type: ApplicationFiled: November 19, 2003Publication date: March 9, 2006Applicant: NEC CORPORATIONInventors: Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo
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Patent number: 6998704Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.Type: GrantFiled: August 21, 2003Date of Patent: February 14, 2006Assignee: NEC CorporationInventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
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Patent number: 6926188Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.Type: GrantFiled: November 4, 2003Date of Patent: August 9, 2005Assignees: NEC Corporation, Japan E.M. Co., Ltd.Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
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Patent number: 6889886Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.Type: GrantFiled: March 25, 2002Date of Patent: May 10, 2005Assignees: NEC Corporation, Japan E.M. Co., LTD.Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
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Publication number: 20050040528Abstract: A method of arranging micro spheres with liquid, a micro sphere arranging device and a semiconductor device, the method comprising the steps of placing the semiconductor device (2) with holes placed, through a large number of pads, on a loading table (3) with variable tilt angle, flowing macro spheres together with conductive liquid held in a holding container (6) down to the semiconductor device (2) to storably place the micro spheres on the pad storably in the holes of the semiconductor device (2), receiving and accumulating the non-stored micro spheres and conductive liquid by a receiving tank (1), and carrying the conductive liquid including the accumulated micro spheres to the holding container (6) by a pump (11)Type: ApplicationFiled: January 10, 2003Publication date: February 24, 2005Inventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko, Hitoshi Anma, Tosiji Yamada, Akeo Katahira
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Publication number: 20040115920Abstract: A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.Type: ApplicationFiled: August 21, 2003Publication date: June 17, 2004Applicant: NEC CORPORATIONInventors: Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa, Hidehiko Kuroda
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Publication number: 20040094601Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.Type: ApplicationFiled: November 4, 2003Publication date: May 20, 2004Inventors: Ichiro Hazeyama, Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima, Kazuhiko Futakami
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Patent number: 6674016Abstract: An electronic component is described, which contains a printed circuit board having electrodes for connection and a semiconductor chip having electrodes for connection which is mounted on said circuit board with their electrodes facing those of the circuit board, the gap between the circuit board and the semiconductor chip being filled with a sealing resin layer, wherein the sealing resin layer is formed of a liquid epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) an N,N,N′,N′-tetrasubstituted fluorine-containing aromatic diamine derivative.Type: GrantFiled: September 19, 2002Date of Patent: January 6, 2004Assignees: Nitto Denko Corporation, NEC CorporationInventors: Masahiro Kubo, Ichiro Hazeyama, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi