Abstract: It is the objective of this invention to reduce deviation in contact resistance variation between electrodes among pressure-sensitive resistor sensors. The sensor is composed of a pair of films. One film has a plurality of electrode portions extending in a certain direction and the other film has at least one electrode portion that is arranged in a transverse relation with a plural of the electrode portions on the other film. Contact points generated by applied pressure are limited to crossing points between the electrode portions of the pair of films. As a result, variation in contact resistance due to applied pressure shift becomes more constant. Thus, it is possible to reduce deviation of contact resistance between the electrodes among sensors.

Abstract: It is the objective of this invention to reduce deviation in contact resistance variation between electrodes among pressure-sensitive resistor sensors. The sensor is composed of a pair of films. One film has a plurality of electrode portions extending in a certain direction and the other film has at least one electrode portion that is arranged in a transverse relation with a plural of the electrode portions on the other film. Contact points generated by applied pressure are limited to crossing points between the electrode portions of the pair of films. As a result, variation in contact resistance due to applied pressure shift becomes more constant. Thus, it is possible to reduce deviation of contact resistance between the electrodes among sensors.

Abstract: This invention provides a circuit board having an electric component which has an electric element smaller than a conventional element. A circuit pattern (5) which includes a pair of contact electrodes (3, 3) is formed on the surface of a board (1) made of an insulating material. A photoresist film (7) is formed on the surface of the board (1). At least one electric element forming hole (9) is formed in the photoresist film (7) by a lithography technology so as to expose at least part of the pair of the contact electrodes (3, 3). The electric element forming hole (9) is filled with an electric element forming paste material to form an electric element (13). A protective film (15) made of a synthetic resin is so formed as to cover the electric element forming hole (9).

Abstract: Pressure sensitive layers are disposed on respective resin films through electrodes to face each other, and include high conductivity flaky carbon particles and low conductivity amorphous-based carbon particles. The two kinds of carbon particles are bound together by a resin-system binder. Accordingly, when a pushing force is applied to the resin films, an average distance between the carbon particles is decreased to cause a tunnel conduction phenomenon, resulting in a decrease in conductive resistance between the electrodes. As a result, a pressure sensing property can be made gentle.

Abstract: A multi-layer circuit board capable of reducing an electrical resistance between circuit patterns positioned inside the circuit board and a through-hole connection conductor. A plurality of circuit patterns are superposed on each other with a plurality of insulating layers being alternately interposed therebetween in turn. A solution in which ultrafine metal particles of the independent dispersion type such as silver, gold, palladium or the like are contained in a colloid-like manner is applied so as to extend from one of lands through an inner surface of a through-hole to the other land. Then, the solution is calcined to form a metal particle film, The metal particle film is coated thereon with a conductive paste such as a resin/silver paste or the like, which is then calcined to form a conductive paste layer.

Abstract: A printed capacitor-mounted circuit board capable of increasing a capacity of each of printed capacitors formed on a printed board. A copper-clad laminate is arranged so as to act as an insulating substrate. The printed capacitors each include a first electrode made of a copper foil and arranged on a front surface of the copper-clad laminate. Then, a dielectric layer made of a dielectric paste is arranged on the first electrode and a second electrode made of a conductive paint is arranged on the dielectric layer.

Abstract: An alignment device for aligning a reticle and a wafer with the aid of a projection lens system for projecting an integrated circuit pattern of the reticle onto the wafer, wherein a light beam from the wafer is passed throught the projection lens and is directed by way of an objective lens to a spatial filter to detect a positional relation between the reticle and the wafer. According to the position of an optical axis of the objective lens relative to an optical axis of the projection lens and according to the telecentricity of the projection lens, the spatial filter is displaced relative to the optical axis of the objective lens, whereby a particular component of the light beam from the wafer is positively extracted out, without being affected against by displacement of the objective lens for the alignment operation.

Abstract: An apparatus for irradiating a first object so as to achieve at least one of alignment between the first object and a second object and transfer of a pattern of the first object onto the second object. The apparatus includes an optical device disposed in the path of the irradiating beam to correct or prevent any change in the optical path length depending on the thickness of the first object.

Abstract: A sheet-like member, such as a reticle, mask or wafer, has alignment marks, which are staggered about a pattern area thereof. The arrangement of the alignment marks is effective to enhance the degree of alignment and also to avoid undesirable overlapping of the reticle mark and the wafer mark.

Abstract: In a mask aligner, the actual element pattern of a mask is transferred onto a resist applied to the surface of a wafer, while the alignment pattern of the mask is not transferred onto said resist. That is, the line width of the alignment pattern of the mask is a line width which is not transferred to the wafer. If the pattern of the mask is formed so that the line width of the alignment pattern is thin as compared with that of the actual element pattern, the exposure amount in the alignment pattern portion on the resist applied to the surface of the wafer becomes excessive due to the diffraction phenomenon and thus, the alignment pattern of the mask is not transferred onto the wafer.