Abstract: An active vibration isolator including a movable stage provides good vibration isolation performance. An active vibration isolator includes: a stage moving under thrust to position a mounted object; a vibration isolation table supporting the stage; a servo valve imparting, to the vibration isolation table, a control force that reduces vibrations of the vibration isolation table; a position/thrust obtaining unit obtaining a position of the stage on a movement track and the thrust actually applied to the stage with movement of the stage; and a vibration control FF control unit performing feed-forward control of the servo valve, based on what is obtained by the position/thrust obtaining unit, to allow the servo valve to generate a control force commensurate with vibrations of the vibration isolation table caused by the movement of the stage.

Abstract: An active vibration isolator including a movable stage provides good vibration isolation performance. An active vibration isolator includes: a stage moving under thrust to position a mounted object; a vibration isolation table supporting the stage; a servo valve imparting, to the vibration isolation table, a control force that reduces vibrations of the vibration isolation table; a position/thrust obtaining unit obtaining a position of the stage on a movement track and the thrust actually applied to the stage with movement of the stage; and a vibration control FF control unit performing feed-forward control of the servo valve, based on what is obtained by the position/thrust obtaining unit, to allow the servo valve to generate a control force commensurate with vibrations of the vibration isolation table caused by the movement of the stage.

Abstract: A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin. The method includes a punching step for forming the lead by punching processing in a direction from the lower surface to its upper surface and a coining step for subjecting the lead to coining processing from the side of the upper surface after the punching processing.

Abstract: A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin. The method includes a punching step for forming the lead by punching processing in a direction from the lower surface to its upper surface and a coining step for subjecting the lead to coining processing from the side of the upper surface after the punching processing.

Abstract: A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin. The method includes a punching step for forming the lead by punching processing in a direction from the lower surface to its upper surface and a coining step for subjecting the lead to coining processing from the side of the upper surface after the punching processing.