Patents by Inventor Ichiro Kitada
Ichiro Kitada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11453207Abstract: Provided is a heat-shrinkable multilayer film including: an outer surface layer including a thermoplastic resin; an intermediate layer including a polyamide resin; and an inner surface layer including a sealable resin; the total thickness of the heat-shrinkable multilayer film being from 95 to 160 ?m; the thickness of the intermediate layer including the polyamide resin being from 17 to 47 ?m; the thickness of the inner surface layer being 55 ?m or greater; and the ratio of the thickness of the intermediate layer including the polyamide resin to the total thickness of the heat-shrinkable multilayer film being from 18 to 29%. The heat-shrinkable multilayer film of the present invention has high strength and excellent flexibility. Therefore, the heat-shrinkable multilayer film of the present invention is easily stretched and formed, and can be suitably used as a variety of packaging materials including a food packaging material.Type: GrantFiled: October 18, 2017Date of Patent: September 27, 2022Assignee: KUREHA CORPORATIONInventors: Shota Nambu, Ichiro Kitada, Tadayoshi Itoh
-
Patent number: 11345124Abstract: A heat-shrinkable multilayer film according to the present invention is obtained by laminating an inner surface layer that contacts contents, an adhesive layer, and an intermediate layer that is adjacent to the adhesive layer, in this order from an inner side to an outer side. The inner surface layer contains an ethylene-vinyl acetate copolymer, the adhesive layer contains an acid-modified ethylene-based copolymer, and the intermediate layer contains a polyamide-based resin.Type: GrantFiled: January 16, 2018Date of Patent: May 31, 2022Assignee: KUREHA CORPORATIONInventors: Ichiro Kitada, Tadayoshi Itoh, Shota Nambu
-
Patent number: 11117354Abstract: To provide a multilayer film that enables easy opening of a packaging material manufactured by deep draw forming. A multilayer film for deep draw forming, including: a vinylidene chloride copolymer resin layer as a middle layer; a crosslinked olefin resin layer as a first surface layer; and an ethylene/vinyl acetate copolymer resin layer as a second surface layer; where the ethylene/vinyl acetate copolymer resin layer is further provided either at least between the vinylidene chloride copolymer resin layer as the middle layer and crosslinked olefin resin layer as the first surface layer, or between the vinylidene chloride copolymer resin layer as the middle layer and ethylene/vinyl acetate copolymer resin layer as the second surface layer.Type: GrantFiled: September 6, 2016Date of Patent: September 14, 2021Assignee: KUREHA CORPORATIONInventors: Ichiro Kitada, Shota Nambu
-
Publication number: 20210229405Abstract: Provided is a heat-shrinkable multilayer film having high strength and excellent followability to its contents. The heat-shrinkable multilayer film according to the present invention is composed of at least three layers of a surface layer (a) including a thermoplastic resin; an intermediate layer (b) including a polyamide-based resin; and a surface layer (c) including a sealable resin. (A) The load per unit width at 10% elongation is 0.70 N/mm or less in both a longitudinal direction (MD) and a transverse direction (TD) in a tensile test at 90° C. (B) The puncture strength per unit thickness is 0.200 N/?m or greater.Type: ApplicationFiled: April 22, 2019Publication date: July 29, 2021Applicant: Kureha CorporationInventors: Shota Nambu, Ichiro Kitada
-
Publication number: 20200055290Abstract: Provided is a heat-shrinkable multilayer film including: an outer surface layer including a thermoplastic resin; an intermediate layer including a polyamide resin; and an inner surface layer including a sealable resin; the total thickness of the heat-shrinkable multilayer film being from 95 to 160 ?m; the thickness of the intermediate layer including the polyamide resin being from 17 to 47 ?m; the thickness of the inner surface layer being 55 ?m or greater; and the ratio of the thickness of the intermediate layer including the polyamide resin to the total thickness of the heat-shrinkable multilayer film being from 18 to 29%. The heat-shrinkable multilayer film of the present invention has high strength and excellent flexibility. Therefore, the heat-shrinkable multilayer film of the present invention is easily stretched and formed, and can be suitably used as a variety of packaging materials including a food packaging material.Type: ApplicationFiled: October 18, 2017Publication date: February 20, 2020Applicant: KUREHA CORPORATIONInventors: Shota NAMBU, Ichiro KITADA, Tadayoshi ITOH
-
Publication number: 20190375200Abstract: A heat-shrinkable multilayer film according to the present invention is obtained by laminating an inner surface layer that contacts contents, an adhesive layer, and an intermediate layer that is adjacent to the adhesive layer, in this order from an inner side to an outer side. The inner surface layer contains an ethylene-vinyl acetate copolymer, the adhesive layer contains an acid-modified ethylene-based copolymer, and the intermediate layer contains a polyamide-based resin.Type: ApplicationFiled: January 16, 2018Publication date: December 12, 2019Inventors: Ichiro KITADA, Tadayoshi ITOH, Shota NAMBU
-
Publication number: 20180250921Abstract: To provide a multilayer film that enables easy opening of a packaging material manufactured by deep draw forming. A multilayer film for deep draw forming, including: a vinylidene chloride copolymer resin layer as a middle layer; a crosslinked olefin resin layer as a first surface layer; and an ethylene/vinyl acetate copolymer resin layer as a second surface layer; where the ethylene/vinyl acetate copolymer resin layer is further provided either at least between the vinylidene chloride copolymer resin layer as the middle layer and crosslinked olefin resin layer as the first surface layer, or between the vinylidene chloride copolymer resin layer as the middle layer and ethylene/vinyl acetate copolymer resin layer as the second surface layer.Type: ApplicationFiled: September 6, 2016Publication date: September 6, 2018Inventors: ICHIRO KITADA, SHOTA NAMBU
-
Patent number: 6436495Abstract: A flexible multilayer film suitable as a (food-)packaging material includes a first seal layer comprising principally a metallocene-catalyzed polyolefin, and a second seal layer comprising a copolymer of at least one oxygen-containing monomer and ethylene. The copolymer is set to have a crystal melting point lower than that of the metallocene-catalyzed polyolefin. The second seal layer may preferably have a thickness larger than that of the first seal layer. Because of the provision of the second seal layer adjacent to the first seal layer, the multilayer film is provided with an improved film-formability while retaining the good sealability of the metallocene-catalyzed polyolefin.Type: GrantFiled: April 7, 2000Date of Patent: August 20, 2002Assignee: Kureha Kagaku Kogyo Kabushiki KaishaInventors: Hajime Tsukamoto, Ichiro Kitada, Yoshiharu Nishimoto
-
Patent number: 6063462Abstract: A flexible multilayer film suitable as a (food-)packaging material includes a first seal layer comprising principally a metallocene-catalyzed polyolefin, and a second seal layer comprising a copolymer of at least one oxygen-containing monomer and ethylene. The copolymer is set to have a crystal melting point lower than that of the metallocene-catalyzed polyolefin. The second seal layer may preferably have a thickness larger than that of the first seal layer. Because of the provision of the second seal layer adjacent to the first seal layer, the multilayer film is provided with an improved film-formability while retaining the good sealability of the metallocene-catalyzed polyolefin.Type: GrantFiled: July 31, 1996Date of Patent: May 16, 2000Assignee: Kureha Kagaku Kogyo Kabushiki KaishaInventors: Hajime Tsukamoto, Ichiro Kitada, Yoshiharu Nishimoto