Abstract: A laminate includes, sequentially and adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which the tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa. A base material is peeled off by fixing any one of the first base material and the second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.

Abstract: Provided are an aqueous dispersion including a microcapsule that contains a core and a shell; a dispersant that is at least one of a carboxylic acid (A) represented by Formula (A) or a salt of the carboxylic acid (A); and water, a method for manufacturing the aqueous dispersion, and an image forming method using the aqueous dispersion [in Formula (A), L represents a divalent linking group, X represents O, NH, or, NR2, R1 represents a hydrocarbon group having 9 or more carbon atoms, R2 represents a hydrocarbon group having 1 to 20 carbon atoms, and n represents 0 or 1].

Abstract: Provided is an ink jet recording method, including a step of jetting, on a substrate, an ink composition A that contains a microcapsule having at least a polymerizable compound within the microcapsule, a high boiling solvent, water, and a colorant, and an ink composition B that contains a microcapsule having at least a polymerizable compound within the microcapsule, a high boiling solvent, water, and carbon black; and a step of heating the ink composition A and the ink composition B which have been jetted on the substrate, in which absorbance ABSA of the ink composition A and absorbance ABSB of the ink composition B satisfy Formula (1), and a concentration MA of the high boiling solvent contained in the ink composition A and a concentration MB of the high boiling solvent in the ink composition B satisfy Formula (2).

Abstract: An ink composition including: a microcapsule having: a shell having a three-dimensional cross-linked structure including at least one of a urethane bond or a urea bond; and a core encapsulated by the shell; a colorant selected from the group consisting of a colorant having an ionic group and a colorant at least a part of a surface of which being covered with a dispersant having an ionic group; and water, a content ratio of an acidic group-containing compound having at least an acidic group, an acid dissociation constant of 5 or less, and a molecular weight of 2000 or less, relative to a total mass of the ink composition, is 0.5 mass % or less; an ink set, a method for producing an ink composition, and an image recording method.

Abstract: Provided are an aqueous dispersion including a microcapsule that has a shell having a three-dimensional cross-linked structure containing at least one bond selected from a urethane bond or a urea bond, and has a core, in which at least one of the shell or the core has a polymerizable group, including a dispersant that has at least one bond selected from a urethane bond or a urea bond and a hydrophilic group, and including water; a method for manufacturing the aqueous dispersion; and an image forming method using the aqueous dispersion.

Abstract: Provided are an aqueous dispersion including a microcapsule and water, the microcapsule including: a shell having a three-dimensional cross-linked structure containing: at least one bond selected from a urethane bond or a urea bond; and an anionic group and a nonionic group as hydrophilic groups; and a core, at least one of the shell having a photopolymerization initiating group or the core containing a photopolymerization initiator being satisfied, and at least one of the shell having a polymerizable group or the core containing a polymerizable compound being satisfied; a method for manufacturing the same; and an image forming method using the aqueous dispersion.

Abstract: Provided are an aqueous dispersion including a microcapsule, and water, the microcapsule including: a shell having a three-dimensional cross-linked structure containing at least one neutralized acid group and at least one bond selected from a urethane bond or a urea bond, in which a degree of neutralization of the acid group contained in the three-dimensional cross-linked structure is from 50% to 100%; and a core, at least one of the shell or the core has a polymerizable group; a method for manufacturing the same; and an image forming method using the aqueous dispersion.

Abstract: Provided are an ink composition including water; and a microcapsule which includes: a shell that has a three-dimensional cross-linked structure containing at least one bond selected from a urethane bond or a urea bond, and including a core that contains a di- or lower functional polymerizable compound, a tri- or higher functional polymerizable compound, and a photopolymerization initiator, in which a proportion of the di- or lower functional polymerizable compound is 20% by mass or more with respect to a total mass of the di- or lower functional polymerizable compound and the tri- or higher functional polymerizable compound, and an image forming method using the ink composition.

Abstract: An ink jet recording method has an ejection step of ejecting, onto a substrate, an ink composition A that includes water, a coloring agent, a photopolymerization initiator, and a microcapsule enclosing a polymerizable compound therein, and an ink composition B that includes water, a coloring agent, a photopolymerization initiator, and a microcapsule enclosing a polymerizable compound therein; and an irradiation step of irradiating, with light, the ink composition A and the ink composition B ejected on the substrate. An absorbance ABSA of the ink composition A and an absorbance ABSB of the ink composition B satisfy a formula (1), and a concentration MA of the microcapsule included in the ink composition A and a concentration MB of the microcapsule included in the ink composition B satisfy a formula (2).

Abstract: Provided are a microcapsule including a shell that has a three-dimensional cross-linked structure containing a hydrophilic group and Structure (1) and including a core that is in the interior of the shell, in which at least one of the shell or the core has a polymerizable group; and an application thereof In Structure (1), X represents a (p+m+n)-valent organic group formed by linking at least two groups selected from —NH—, >N—, —C(?O)—, —O—, —S—, and an aliphatic hydrocarbon group which may have a ring structure, provided that an organic group having an aromatic ring is excluded from X, R1 to R3 represent an aliphatic hydrocarbon group having 5 to 15 carbon atoms which may have a ring structure, provided that an aliphatic hydrocarbon group having an aromatic ring is excluded from R1 to R3, and * represents a binding position, each of p, m, and n is equal to or greater than 0, and p+m+n equals 3 or greater.

Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

Abstract: Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

Abstract: Provided are a laminate which is capable of forming an excellent organic semiconductor pattern, a kit for manufacturing an organic semiconductor, which is used to manufacture such a laminate, and a resist composition for manufacturing an organic semiconductor, which is used for the kit for manufacturing an organic semiconductor. The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (A) which generates an organic acid of which a pKa of the generated acid is ?1 or less and a resin (B) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.

Abstract: To provide a laminate, a temporary adhesion composition, and a temporary adhesion film which are capable of making warpage less likely to occur even when a wafer is thin. Provided is a laminate including, sequentially being adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which a tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa, a base material is peeled off by fixing any one of a first base material and a second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.

Abstract: Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C.

Abstract: There is provided a laminate body which is capable of forming an excellent pattern on an organic semiconductor. A laminate body includes at least a water-soluble resin film and a resist film formed of a chemically amplified photosensitive resin composition on a surface of an organic semiconductor film in this order, in which the chemically amplified photosensitive resin composition contains a photoacid generator which is decomposed in an amount of 80% by mole or greater when exposed to light under the condition of 100 mJ/cm2 or greater at a wavelength of 365 nm, a mask pattern is formed by an exposed portion being hardly soluble in a developer containing an organic solvent, and the formed mask pattern is used as an etching mask.

Abstract: Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes comprising (A) a release layer and (B) an adhesive layer wherein the release layer (A) comprises (a1) a resin 1 having a softening point of 200° C. or more and (a2) a resin 2; the resin 2 after curing has capable of being dissolved at 5% by mass or more, at 25° C., in at least one of solvents selected from hexane and the like.

Abstract: Provided is temporary bonding laminates for used in a manufacture of semiconductor devices, by which a member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member to be processed and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process, and processes for manufacturing semiconductor devices. The temporary bonding laminate includes (A) a release layer and (B) an adhesive layer, wherein the release layer (A) comprises (a1) a first release layer having a softening point of 200° C. or more and adjoining the adhesive layer (B), and (a2) a second release layer adjoining the first release layer (a1); the second release layer (a2) contains a resin; and the resin after curing has a capable of being dissolved at 5% by mass or more, at 25° C., in at least one kind of solvents selected from hexane and the like.

Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

Abstract: Provided are a thermal base generator which is capable of performing cyclization of a. thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40° C. or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A1 represents a p-valent organic group, R1 represents a monovalent organic group, L1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.