Abstract: A method of producing a skin-covered pad for a seat, which includes by steps (a) preparing a lower mold which has a cavity formed therein, the mold having projections on a bottom of the cavity; (b) putting a bag-shaped outer skin member into the cavity, the skin member being thermally plastic; (c) putting an upper mold on the lower mold to close the cavity, the upper mold having an aperture formed therethrough; (d) projecting a press member into the cavity through the aperture, the press member having at its work head recesses which are shaped to match with the projections of the lower mold; (e) pressing the recessed work head of the press member against the projections of the lower mold with an interposal of a part of the outer skin member therebetween; (f) heating the work head of the press member thereby to soften the part of the outer skin member; (g) separating the work head of the press member away from the projections of the lower mold; and (h) pouring a liquid material for foamed plastic into the cavi

Abstract: A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt % vitreous PbO-B.sub.2 O.sub.3 solder glass powder having a deformation point of 350.degree. C. or less, 0-45 wt % low thermal expansion ceramic powder and 2-40 wt % zircon powder. The zircon powder is of a synthetic zircon artificially prepared to eliminate radioactive impurities such as uranium and/or thorium and contains 0.5-7 wt % Fe.sub.2 O.sub.3, MnO and/or ZnO without alkali impurities and without non-reacted zirconium oxide. The composition has an improved flowability.

Abstract: A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt % vitreous solder glass powder of PbO-B.sub.2 O.sub.3 system having a deformation point of 350.degree. C. or less, 1-35 wt % zinc material powder and 1-35 wt % zircon powder. The zircon powder is of a synthetic zircon artificially prepared to eliminate radioactive impurities such as uranium and/or thorium.

Abstract: A sealing composition suitable for sealing alumina packages for integrated circuits at a temperature below about 450.degree. C. for a short time of about 10 minutes. The composition is a mixture of 50-80 wt. % vitreous solder glass powder of PbO-B.sub.2 O.sub.3 system having a deformation point of 350.degree. C. or less, 1-35 wt. % first ceramic powder and 1-45 wt. % second ceramic powder. The total amount of the first and second ceramic powders is 20-50 wt. %. The first ceramic comprises 68-75 wt. % ZnO, 23-28 wt. % SiO.sub.2 and 0-8 wt. % Al.sub.2 O.sub.3, and the second ceramic comprises 98-99.9 wt. % SnO.sub.2 and 0.1-2 wt. % ZnO.

Abstract: A low temperature sealing glass composition consisting of 60-80% by weight of vitreous solder glass of PbO-B.sub.2 O.sub.3 system having a deformation point of 350.degree. C. or less, and 20-40% by weight of willemite. The vitreous PbO-B.sub.2 O.sub.3 system glass comprises 70-90% by weight of PbO, 10-15% by weight of B.sub.2 O.sub.3, 0.5-5% by weight of SiO.sub.2, 0-5% by weight of Al.sub.2 O.sub.3, 0-5% by weight of ZnO, 0-15% by weight of PbF.sub.2 and 0-5% by weight of Bi.sub.2 O.sub.3.