Abstract: This invention provides a circuit board having an electric component which has an electric element smaller than a conventional element. A circuit pattern (5) which includes a pair of contact electrodes (3, 3) is formed on the surface of a board (1) made of an insulating material. A photoresist film (7) is formed on the surface of the board (1). At least one electric element forming hole (9) is formed in the photoresist film (7) by a lithography technology so as to expose at least part of the pair of the contact electrodes (3, 3). The electric element forming hole (9) is filled with an electric element forming paste material to form an electric element (13). A protective film (15) made of a synthetic resin is so formed as to cover the electric element forming hole (9).

Abstract: A multi-layer circuit board capable of reducing an electrical resistance between circuit patterns positioned inside the circuit board and a through-hole connection conductor. A plurality of circuit patterns are superposed on each other with a plurality of insulating layers being alternately interposed therebetween in turn. A solution in which ultrafine metal particles of the independent dispersion type such as silver, gold, palladium or the like are contained in a colloid-like manner is applied so as to extend from one of lands through an inner surface of a through-hole to the other land. Then, the solution is calcined to form a metal particle film, The metal particle film is coated thereon with a conductive paste such as a resin/silver paste or the like, which is then calcined to form a conductive paste layer.

Abstract: A printed capacitor-mounted circuit board capable of increasing a capacity of each of printed capacitors formed on a printed board. A copper-clad laminate is arranged so as to act as an insulating substrate. The printed capacitors each include a first electrode made of a copper foil and arranged on a front surface of the copper-clad laminate. Then, a dielectric layer made of a dielectric paste is arranged on the first electrode and a second electrode made of a conductive paint is arranged on the dielectric layer.