Abstract: A material processing method has a process of reading image data of a material. The material has answer fields and information items on points distributed to the answer fields. The method also has extracting the distributed point information items based on the image data, associating the distributed point information items with answer fields to recognize the points distributed to each answer field, storing a result recognized the points distributed to each answer field as answer/distributed point correspondence information, recognizing correct/incorrect answer determining contents from the image data, and performing point totaling on the correct/incorrect answer determining contents based on the answer/distributed point correspondence information.

Abstract: The present invention includes a first and a second optical path forming member arranged within a path of light beams from a light source; a first mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the first optical path forming member, and a second mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the second optical path forming member, each of the mounting tables being configured to be rotatable about a vertical axis while mounting the substrate thereon; and a light blocking means for blocking application of light from each of the first and second optical path forming members.

Abstract: The present invention includes a first and a second optical path forming member arranged within a path of light beams from a light source; a first mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the first optical path forming member, and a second mounting table provided such that the edge portion of the substrate is located within an application region of the light beams from an outlet side of the second optical path forming member, each of the mounting tables being configured to be rotatable about a vertical axis while mounting the substrate thereon; and a light blocking means for blocking application of light from each of the first and second optical path forming members.

Abstract: A system and method for performing optical inspection of structures on the surface of a semiconductor wafer. The wafer surface is illuminated with a polychromatic light source. A multiple-charged couple-device (CCD) camera is positioned to capture light diffracted by the structures on the wafer surface at the first order of diffraction. The captured light is then separated into a plurality of component wavelengths which are directed onto the CCDs. A digital filter creates a plurality of digitized diffractive images of the wafer surface at different component wavelengths. The diffractive images may be integrated and analyzed to detect defects in the structures, or may be, analyzed individually. An image at a particular wavelength may be selected and analyzed by using the known grating pitch of the structures to calculate the wavelength.

Abstract: A system and method for performing optical inspection of structures on the surface of a semiconductor wafer. The wafer surface is illuminated with a polychromatic light source. A multiple-charged couple-device (CCD) camera is positioned to capture light diffracted by the structures on the wafer surface at the first order of diffraction. The captured light is then separated into a plurality of component wavelengths which are directed onto the CCDs. A digital filter creates a plurality of digitized diffractive images of the wafer surface at different component wavelengths. The diffractive images may be integrated and analyzed to detect defects in the structures, or may be analyzed individually. An image at a particular wavelength may be selected and analyzed by using the known grating pitch of the structures to calculate the wavelength.