Patents by Inventor Ichirou Muraki

Ichirou Muraki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for high frequency usages and its manufacturing method
    Patent number: 7632716
    Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: December 15, 2009
    Assignee: Sumitomo Metal (SMI) Electronics Devices, Inc.
    Inventors: Ichirou Muraki, Kouichi Nakasu, Akiyoshi Osakada
  • PACKAGE FOR HIGH FREQUENCY USAGES AND ITS MANUFACTURING METHOD
    Publication number: 20060193116
    Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.
    Type: Application
    Filed: May 9, 2006
    Publication date: August 31, 2006
    Applicant: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Akiyoshi Osakada, Ichirou Muraki, Kouichi Nakasu
  • Apparatus and package for high frequency usages and their manufacturing method
    Publication number: 20040246682
    Abstract: A package for high frequency usages 10 has a notched area 16 on each longitudinal end of a substantially rectangular heat sink plate 11 for fastening the package to a base 20 with a screw. The package includes a joined member 17 formed by joining a surface of a ring-like frame member 12 made of a ceramic material to the longitudinal center of a surface of heat sink plate 11 and joining another surface to an external connection terminal 15. The other surface of heat sink plate 11 presents a curved protruding shape 18 bowing from its longitudinal ends toward its longitudinal center, so that curved protruding shape 18 causes at least an area of the other surface heat sink plate 11 that corresponds to an area dedicated for mounting a semiconductor device 19 within ring-like frame member 12 to make a close contact with base 20 when the package is fastened to base 20 by the screw at notched areas 16.
    Type: Application
    Filed: June 1, 2004
    Publication date: December 9, 2004
    Applicant: Sumitomo Metal (SMI) Eectronics Devices Inc.
    Inventors: Akiyoshi Osakada, Ichirou Muraki, Kouichi Nakasu