Abstract: A position deviation system and method detects and corrects position deviations between the optical axis of an optical system, such as an exposure apparatus, and the center of a curved shaped object, such as a spherical shaped semiconductor. The system determines position deviations by illuminating the curved surface, passing light that is reflected off of the illuminated curved surface through a first lens having an optical axis and a first body. An image having a substantially central portion is formed on a surface using the reflected light. The position deviation is determined based on a position of the substantially central portion of the formed image relative to the optical axis.

Abstract: A semiconductor manufacturing station (50) exposes light on a surface area of a spherical semiconductor device or ball (52). A mask pattern generator (56) provides a pattern of light, which undergoes temporal changes to collectively represent an image. The mask pattern generator has an active exposure contour (80) that provides a portion of the overall image. The pattern of light is directed though a lens (62) to the surface area of the semiconductor device. The semiconductor device rotates in relation to the temporal changes in the pattern of light to expose the pattern of light over a portion of a surface area of the semiconductor device. The exposure contour has a narrower center and becomes wider moving away from the center. The exposure contour may have a curvature.

Abstract: A position deviation system (10) and method detects and corrects position deviations between the optical axis (118) of an optical system (100), such as an exposure apparatus (150), and the center of a curved shaped object, such as a spherical shaped semiconductor. The system determines position deviations by illuminating the curved surface (124), passing light that is reflected off of the illuminated curved surface (124) through a first lens (112) having an optical axis (118) and a first body. An image having a substantially central portion is formed on a surface using the reflected light. The position deviation is determined based on a position of the substantially central portion of the formed image relative to the optical axis (118).

Abstract: A semiconductor manufacturing station (50) exposes light on a surface area of a spherical semiconductor device or ball (52). A mask pattern generator (56) provides a pattern of light, which undergoes temporal changes to collectively represent an image. The mask pattern generator has an active exposure contour (80) that provides a portion of the overall image. The pattern of light is directed though a lens (62) to the surface area of the semiconductor device. The semiconductor device rotates in relation to the temporal changes in the pattern of light to expose the pattern of light over a portion of a surface area of the semiconductor device. The exposure contour has a narrower center and becomes wider moving away from the center. The exposure contour may have a curvature.