Abstract: A home port for a semiconductor manufacturing nozzle head includes a body having a discharge space configured to receive treatment liquid discharged from a plurality of nozzles, discharge flow passages connected to be in communication with the discharge space and penetrating through the body so as to face the plurality of nozzles, and a cleaning liquid distribution system, which is formed to penetrate through the body, and is connected to transfer a cleaning liquid to the discharge flow passages. The cleaning liquid distribution system includes supply flow passages connected to supply the cleaning liquid to the discharge flow passages, and a lead-in passage connected to and which joins the supply flow passages, and connected to receive the cleaning liquid injected from the outside.

Abstract: An optical module includes optical transmission member, optical element, substrate, electrode pad between the optical element and external circuit, and optical block including optical transmission member mounting portion. The optical transmission member mounting portion is formed on the optical block in optical axis direction such that optical transmission efficiency is the maximum. A manufacturing method of the optical module includes mounting and electrically connecting the optical element on one face of the substrate, calculating a position on a 2-dimensional plane of optical input/output point of the optical element, forming base material of the optical block to impregnate the optical element onto the substrate, forming the optical transmission member mounting portion at the position on the 3-dimensional plane of the optical input/output point calculated in the former step on the base material, and mounting the optical transmission member on the optical transmission member mounting portion.

Abstract: Disclosed is a photoelectric wiring module which includes: a substrate; a frame mounted on the substrate; an optical device package configured to perform photoelectric conversion or electro-optic conversion of a signal; an optical control device configured to control an operation of the optical device package; and an optical transmission line configured to transmit an optical signal that is emitted from the optical device package or incident on the optical device package. Electrical terminals are disposed on the frame, the optical device package is mounted on the frame, and the optical control device is disposed within the frame and mounted on the substrate.

Abstract: An optical module includes optical transmission member, optical element, substrate, electrode pad between the optical element and external circuit, and optical block including optical transmission member mounting portion. The optical transmission member mounting portion is formed on the optical block in optical axis direction such that optical transmission efficiency is the maximum. A manufacturing method of the optical module includes mounting and electrically connecting the optical element on one face of the substrate, calculating a position on a 2-dimensional plane of optical input/output point of the optical element, forming base material of the optical block to impregnate the optical element onto the substrate, forming the optical transmission member mounting portion at the position on the 3-dimensional plane of the optical input/output point calculated in the former step on the base material, and mounting the optical transmission member on the optical transmission member mounting portion.

Abstract: Disclosed is a photoelectric wiring module which includes: a substrate; a frame mounted on the substrate; an optical device package configured to perform photoelectric conversion or electro-optic conversion of a signal; an optical control device configured to control an operation of the optical device package; and an optical transmission line configured to transmit an optical signal that is emitted from the optical device package or incident on the optical device package. Electrical terminals are disposed on the frame, the optical device package is mounted on the frame, and the optical control device is disposed within the frame and mounted on the substrate.