Patents by Inventor Idan Nissel

Idan Nissel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Full Die and Partial Die Tape Outs from Common Design
    Publication number: 20230053664
    Abstract: A chip design methodology and a set of integrated circuits that are taped out from a common design database are disclosed. The area of a full instance of the integrated circuit is defined, and one or more chop lines are defined to identify portions that will be removed for one or more partial instances. A variety of techniques and mechanisms are defined to permit the tape outs to occur from a common design database, so that the effort to tape out partial instances may be minimized beyond that to tape out the full instance.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 23, 2023
    Inventors: Haim Hauzi, Eran Tamari, Per H. Hammarlund, Jonathan M. Redshaw, Alfredo Kostianovsky, Idan Nissel, Leonid Gitelman, Oren Betzalel, Dalia R. Haim, Lior Zimet