Patents by Inventor Ieeseul Jeong

Ieeseul Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a semiconductor package
    Patent number: 10636761
    Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: April 28, 2020
    Assignee: Electronics and Telecommunications Reearch Institute
    Inventors: Kwang-Seong Choi, Yong-Sung Eom, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Ieeseul Jeong, Wagno Alves Braganca Junior