Patents by Inventor Ignacio McQuirk

Ignacio McQuirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packages incorporating an inductor and methods
    Patent number: 7969002
    Abstract: Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate, the assembly is encapsulated in resin, and the leads trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate. Various embodiments are disclosed.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: June 28, 2011
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Ahmad Ashrafzadeh, Mansour Izadinia, Nitin Kalje, Ignacio McQuirk
  • Integrated Circuit Packages Incorporating an Inductor and Methods
    Publication number: 20100102416
    Abstract: Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate, the assembly is encapsulated in resin, and the leads trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate. Various embodiments are disclosed.
    Type: Application
    Filed: October 29, 2008
    Publication date: April 29, 2010
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: Ahmad Ashrafzadeh, Mansour Izadinia, Nitin Kalje, Ignacio McQuirk