Abstract: Magnetic sensor assembly (1) having a magnetic sensor (2) with a main sensor surface (2a) and four side surfaces (2b), and a lead frame (3) having a main lead frame surface (3a). The magnetic sensor (2) is positioned onto the lead frame (3) with one of the four side surfaces (2b), and the main sensor surface (2a) is oriented perpendicular to the main lead frame surface (3a). The magnetic sensor (2) has a first plurality of contact pads (4), the lead frame (3) a second plurality of external bond pads (5). The first plurality of contact pads (4) are connected to a subgroup of the second plurality of external bond pads (5) by a conductive glue (6).

Abstract: Magnetic sensor assembly (1) having a magnetic sensor (2) with a main sensor surface (2a) and four side surfaces (2b), and a lead frame (3) having a main lead frame surface (3a). The magnetic sensor (2) is positioned onto the lead frame (3) with one of the four side surfaces (2b), and the main sensor surface (2a) is oriented perpendicular to the main lead frame surface (3a). The magnetic sensor (2) has a first plurality of contact pads (4), the lead frame (3) a second plurality of external bond pads (5). The first plurality of contact pads (4) are connected to a subgroup of the second plurality of external bond pads (5) by a conductive glue (6).

Abstract: An integrated circuit sensor package (1) with a package body (5) moulded at least in part around a substrate (2) and a plurality of lead frame members (6, 8). The substrate (2) has a first sensor element (3) on a first side surface (2a). The package body (5) comprises an aperture (5a) exposing a sensitive surface (4) of the first sensor element (3). Electrically conductive glue connections (7, 9) are provided between contact terminals of the first sensor element (3) and one or more of the plurality of lead frame members (6, 8).

Abstract: A sensor package 1 includes a sensor carrier 2 with a sensor element 4, a pre-moulded tray part 10 with an exposed cavity 12, the sensor carrier 2 with the sensor element 4 being positioned in a recess 21 of the pre-moulded tray part 10 part to extend into the exposed cavity 12. A lead frame 6 is arranged to provide external connections of the sensor package 1, an over-moulding package part 8, arranged around the lead frame 6 and the pre-moulded tray part 10 and having an aperture 12a aligned with the exposed cavity 12.

Abstract: An integrated circuit sensor package (1) with a package body (5) moulded at least in part around a substrate (2) and a plurality of lead frame members (6, 8). The substrate (2) has a first sensor element (3) on a first side surface (2a). The package body (5) comprises an aperture (5a) exposing a sensitive surface (4) of the first sensor element (3). Electrically conductive glue connections (7, 9) are provided between contact terminals of the first sensor element (3) and one or more of the plurality of lead frame members (6, 8).

Abstract: Method of making an integrated circuit package, by a) providing a plurality of die members (4a, 4b) connected to respective electrical contact members (8a, 8b) in a mould; b) providing a mould insert in contact with at least a part of a first upper surface (6a) of a first die member (4a); c) encasing the plurality of die members (4a, 4b) and the respective electrical contact members (8a, 8b) into a package collection body (3); and d) cutting the package collection body (3) into at least two separate integrated circuit packages (3a, 3b) along a first cutting line (S1) extending through the package collection body (3) and separating the plurality of die members (4a, 4b). The mould insert as provided in step b) extends across a part of the first cutting line (S1).

Abstract: A sensor package 1 includes a sensor carrier 2 with a sensor element 4, a pre-moulded tray part 10 with an exposed cavity 12, the sensor carrier 2 with the sensor element 4 being positioned in a recess 21 of the pre-moulded tray part 10 part to extend into the exposed cavity 12. A lead frame 6 is arranged to provide external connections of the sensor package 1, an over-moulding package part 8, arranged around the lead frame 6 and the pre-moulded tray part 10 and having an aperture 12a aligned with the exposed cavity 12.

Abstract: Method of making an integrated circuit package, by a) providing a plurality of die members (4a, 4b) connected to respective electrical contact members (8a, 8b) in a mould; b) providing a mould insert in contact with at least a part of a first upper surface (6a) of a first die member (4a); c) encasing the plurality of die members (4a, 4b) and the respective electrical contact members (8a, 8b) into a package collection body (3); and d) cutting the package collection body (3) into at least two separate integrated circuit packages (3a, 3b) along a first cutting line (S1) extending through the package collection body (3) and separating the plurality of die members (4a, 4b). The mould insert as provided in step b) extends across a part of the first cutting line (S1).