Patents by Inventor Ignatius Rasiah

Ignatius Rasiah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal interconnect and interface systems, methods of production and uses thereof
    Publication number: 20070164424
    Abstract: Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component.
    Type: Application
    Filed: March 31, 2004
    Publication date: July 19, 2007
    Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran, Ignatius Rasiah