Patents by Inventor Igor Fidelman

Igor Fidelman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for thermally processing a plurality of wafer-shaped objects
    Patent number: 7977258
    Abstract: Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: July 12, 2011
    Assignee: Mattson Technology, Inc.
    Inventors: Zsolt Nenyei, Paul J. Timans, Wilfried Lerch, Jüergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O'Carroll, Rudy Cardema, Igor Fidelman, Sing-Pin Tay, Yao Zhi Hu, Daniel J. Devine
  • Method and system for thermally processing a plurality of wafer-shaped objects
    Publication number: 20080248657
    Abstract: Process and system for processing wafer-shaped objects, such as semiconductor wafers is disclosed. In accordance with the present disclosure, a multiple of two wafers are processed in a thermal processing chamber. The thermal processing chamber is in communication with at least one heating device for heating the wafers. The wafers are placed in the thermal processing chamber in a face-to-face configuration or in a back-to-back configuration.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 9, 2008
    Inventors: Zsolt Nenyei, Paul J. Timans, Wilfried Lerch, Juergen Niess, Manfred Falter, Patrick Schmid, Conor Patrick O'Carroll, Rudy Cardema, Igor Fidelman, Sing-Pin Tay, Yao Zhi Hu, Daniel J. Devine
  • Cooled window
    Patent number: 6284051
    Abstract: A cooled window assembly for a thermal processing chamber, wherein an object in the chamber is heated by a radiation source outside the chamber emitting radiation that includes infrared radiation. The assembly includes upper and lower transparent plates defining passages therebetween. A cooling fluid flows through the passages, which fluid is substantially transparent to the infrared radiation, such that the infrared radiation from the source passes through the plates and through the fluid in the passages to heat the object. The upper plate is substantially thicker than the lower plate, thus providing the window with mechanical strength sufficient withstand atmospheric pressure when the chamber is evacuated.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: September 4, 2001
    Assignee: AG Associates (Israel) Ltd.
    Inventor: Igor Fidelman
  • Method and apparatus for increasing temperature uniformity of heated wafers
    Patent number: 6084213
    Abstract: A method and apparatus are described for increasing the temperature uniformity of a wafer heated in a rapid thermal process (RTP) while the wafer is supported by a high emissivity structure in spaced relation above the head during the heating of the wafer; characterized in that a high-reflectivity ring, highly reflective to the radiation of the wafer, is provided on the head underlying the high emissivity ring.
    Type: Grant
    Filed: May 18, 1998
    Date of Patent: July 4, 2000
    Assignee: Steag C.V.D. Sytems, Ltd.
    Inventors: Gil Kohav, Igor Fidelman, Arie Harnik