Patents by Inventor Igor Giterman
Igor Giterman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240353268Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: July 1, 2024Publication date: October 24, 2024Inventor: Igor Giterman
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Patent number: 12078552Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: November 15, 2022Date of Patent: September 3, 2024Assignee: HarcoSemco, LLCInventor: Igor Giterman
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Publication number: 20240159601Abstract: A Mass Flow Sensor (MFS) is provided and includes an MFS housing, a mounting structure, having a mounting structure top and a mounting structure bottom, wherein the MFS housing is associated with the mounting structure top, a first sensor leg, wherein the first sensor leg extends away from the mounting structure bottom and includes a first temperature measurement device and a heating element. The MFS further includes a second sensor leg, wherein the second sensor leg extends away from the mounting structure and includes a second temperature measurement device and an airfoil structure, wherein the airfoil structure defines an airfoil cavity and is associated with the mounting structure bottom to contain the first sensor leg and the second sensor leg.Type: ApplicationFiled: November 14, 2023Publication date: May 16, 2024Applicant: HarcoSemco LLCInventors: Igor Giterman, Robert A. Croce, JR.
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Patent number: 11846549Abstract: A Mass Flow Sensor (MFS) is provided and includes an MFS housing, a mounting structure, having a mounting structure top and a mounting structure bottom, wherein the MFS housing is associated with the mounting structure top, a first sensor leg, wherein the first sensor leg extends away from the mounting structure bottom and includes a first temperature measurement device and a heating element. The MFS further includes a second sensor leg, wherein the second sensor leg extends away from the mounting structure and includes a second temperature measurement device and an airfoil structure, wherein the airfoil structure defines an airfoil cavity and is associated with the mounting structure bottom to contain the first sensor leg and the second sensor leg.Type: GrantFiled: September 14, 2020Date of Patent: December 19, 2023Assignee: HarcoSemco LLCInventors: Igor Giterman, Robert A. Croce, Jr.
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Publication number: 20230079363Abstract: A Mass Flow Sensor (MFS) is provided and includes an MFS housing, a mounting structure, having a mounting structure top and a mounting structure bottom, wherein the MFS housing is associated with the mounting structure top, a first sensor leg, wherein the first sensor leg extends away from the mounting structure bottom and includes a first temperature measurement device and a heating element. The MFS further includes a second sensor leg, wherein the second sensor leg extends away from the mounting structure and includes a second temperature measurement device and an airfoil structure, wherein the airfoil structure defines an airfoil cavity and is associated with the mounting structure bottom to contain the first sensor leg and the second sensor leg.Type: ApplicationFiled: September 14, 2020Publication date: March 16, 2023Applicant: HARCO, LLCInventors: Robert, Jr. A. Croce, Igor Giterman
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Publication number: 20230078435Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: November 15, 2022Publication date: March 16, 2023Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Patent number: 11525741Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: April 21, 2022Date of Patent: December 13, 2022Assignee: HarcoSemco LLCInventor: Igor Giterman
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Publication number: 20220260430Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: June 28, 2021Publication date: August 18, 2022Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Publication number: 20220244110Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: April 21, 2022Publication date: August 4, 2022Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Patent number: 11198513Abstract: An anti-icing/de-icing system for an airfoil structure having multiple layers is provided and includes a thermal article, wherein the thermal article is embedded within the airfoil structure to be located between the multiple layers. The thermal article includes a first terminal end, a second terminal end and a thermal expanded mesh material which connects the first terminal end with the second terminal end, and wherein the thermal expanded mesh material is configured to have at least one predetermined resistance between the first terminal end and the second terminal end.Type: GrantFiled: April 15, 2019Date of Patent: December 14, 2021Assignee: Astroseal Products Mfg. CorporationInventors: Michael Milardo, Igor Giterman
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Patent number: 11047744Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: February 15, 2021Date of Patent: June 29, 2021Assignee: HARCO-SEMCO, LLCInventor: Igor Giterman
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Publication number: 20210164846Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: February 15, 2021Publication date: June 3, 2021Applicant: HarcoSemco, LLCInventor: Igor Giterman
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Patent number: 10921196Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: GrantFiled: February 24, 2017Date of Patent: February 16, 2021Assignee: HarcoSemco, LLCInventor: Igor Giterman
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Publication number: 20200341076Abstract: A proximity sensor system and a method for implementing the proximity sensor system is provided, wherein the proximity sensor system includes a sensor article, wherein the sensor article includes a sensor sensing surface and wherein the sensor article is configured to sense the magnetic field of a target article located proximate the sensor sensing surface and generate a sensor signal, a temperature compensation article, wherein the temperature compensation article includes components configured to generate a predetermined TCA signal and a processor, wherein the processor is configured to process the sensor signal and the TCA signal and to generate a processor output signal.Type: ApplicationFiled: April 28, 2019Publication date: October 29, 2020Inventor: Igor Giterman
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Publication number: 20170292876Abstract: An optimized thermocouple system and a method of optimizing a thermocouple system having a plurality of thermocouple probes and a junction box is provided and includes examining the thermocouple system to identify a first thermocouple probe of the plurality of thermocouple probes, wherein the first thermocouple probe includes a first positive leg and a first negative leg and is located electrically farthest from the junction box. The method includes calculating a first loop resistance between the first thermocouple probe and the junction box and configuring a second thermocouple probe of the plurality of thermocouple probes having a second positive leg, a second negative leg and a second loop resistance such that the second loop resistance is substantially equal to the first loop resistance.Type: ApplicationFiled: February 24, 2017Publication date: October 12, 2017Applicant: HARCO, LLCInventor: Igor Giterman
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Publication number: 20140311796Abstract: A wire harness and method for manufacturing thereof are provided. The wire harness includes a plurality of wires, a terminal member, an inverted sleeve, and a high temperature moisture resistant sealant. The plurality of wires includes one or more wires with protective layers of metal and fiberglass and skived Teflon tape as a moisture barrier where at least one end of the wires with protective layers of metal and fiberglass is connected with a terminal member. Protection from moisture is enhanced by enclosing at least one end of the wires with protective layers of metal glass with the inverted sleeve. The inverted sleeve provided has ends where each end has a fold, thereby preventing frayed edges from being exposed to the sleeve's surrounding environment. The inverted sleeve is coated with a high temperature moisture resistant sealant and encloses junctions between wire ends and terminal members and/or junctions between terminal members.Type: ApplicationFiled: April 17, 2013Publication date: October 23, 2014Applicant: Harco Laboratories, Inc.Inventors: Robert C. Gannon, John M. Champagne, Igor Giterman
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Publication number: 20140202244Abstract: The present invention refers to a sensor device and associated method of locking sensor device components. In some aspects of the invention, a housing assembly comprises a housing case for an exhaust gas temperature probe sensor device that can be used to lock one or more traversing studs and form an environmental seal using a plurality of insulators and a fastener locked onto the elongated body of each of the studs. The locking features of the housing case and locking part geometry can function to securely hold and align parts when the fastener is locked into place. The fastener can be a press fit bushing with a bushing weld.Type: ApplicationFiled: January 18, 2013Publication date: July 24, 2014Applicant: HARCO LABORATORIES, INC.Inventor: Igor Giterman
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Patent number: 7137297Abstract: A method for coupling components of a fluid sensor assembly for a vehicle, the method comprising the steps of providing a body portion of a fluid sensor assembly with a joining section that has a mating surface, providing a head portion of a fluid sensor assembly with a joining section that has a mating surface, introducing the mating surface of the body portion joining section to the mating surface of the head portion joining section to define a overlapping configuration, providing a first magnetic field that opposes a second magnetic field to produce a force field, exposing the overlapped configuration to the force field that surpasses both joining sections' material yield strength without causing either joining section's material to flow and coupling together the mating surfaces of both joining sections of the overlapped configuration with the force field to form a fluid sensor assembly.Type: GrantFiled: May 11, 2004Date of Patent: November 21, 2006Assignee: Harco Laboratories, Inc.Inventor: Igor Giterman
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Publication number: 20050252288Abstract: A method for coupling components of a fluid sensor assembly for a vehicle, the method comprising the steps of providing a body portion of a fluid sensor assembly with a joining section that has a mating surface, providing a head portion of a fluid sensor assembly with a joining section that has a mating surface, introducing the mating surface of the body portion joining section to the mating surface of the head portion joining section to define a overlapping configuration, providing a first magnetic field that opposes a second magnetic field to produce a force field, exposing the overlapped configuration to the force field that surpasses both joining sections' material yield strength without causing either joining section's material to flow and coupling together the mating surfaces of both joining sections of the overlapped configuration with the force field to form a fluid sensor assembly.Type: ApplicationFiled: May 11, 2004Publication date: November 17, 2005Inventor: Igor Giterman
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Patent number: 6881932Abstract: An improved air data sensing probe de-icing system that provides for dramatically increased reliability and lifespan, utilizing solid-state heating elements that are electrically connected in parallel and having inherent temperature control, where each of the heating elements are able to provide full system power in the event of failure of one of the heating elements such that system redundancy and de-rating is achieved.Type: GrantFiled: April 29, 2003Date of Patent: April 19, 2005Assignee: Harco Laboratories, Inc.Inventor: Igor Giterman