Abstract: A process in which micromechanical bushings can be made and the application of such process to making micromechanical devices. Bushings are made on a surface of a stationary structure extending from a planar surface. The bushings are separated from the stationary structure by a sacrificial layer. The stationary structure, the bushing and the planar surface are then further processed by coating with a second sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by a curved, undercut edge such as gear on stool. Final processing includes removing both sacrificial layers to free the movable structure, the bushing, and the stationary structure from each other. The bushing is trapped between the movable structure and the stationary structure but able to move freely.

Abstract: A method of manufacturing a one piece full width ink jet printing bar starting with a glass or ceramic plate with conductive vias, metal interconnects and ink feeds preformed on the plate. Heater filaments are formed from a suitable metal such as tungsten, nickel or tantalum on the plate and insulated from the metal interconnects with silicon nitride. Jet chambers and transport chambers to transport the ink from the ink feeds to the jet chambers are formed using sacrificial material and a structural layer. After the structural layer has been patterned the sacrificial material is removed forming the jet chambers and the transport chambers. Bonding bumps are then formed on the reverse side of the ceramic or glass plate from the jet chambers to provide connections to electronic components which determine which ink jet chambers should fire.

Abstract: A process for making a tip microstructure in amorphous silicon or polysilicon. A layer of nitride is first deposited on the amorphous silicon or polysilicon. Then the amorphous silicon or polysilicon is roughly patterned to form the base of the tip structure. the tip is carved out of the amorphous silicon or polysilicon by using an oxide growth process that is controlled by the amount of dopant in the amorphous silicon or polysilicon. After the tip is carved, the oxide is stripped away exposing the tip.

Abstract: A process for making a micromechanical generally bowl shaped or round shaped element upon a substrate by providing a member having a generally planar surface and walls extending from the surface Bumpers are then grown into the walls. The generally round shaped oxide bumpers form a generally bowl shaped convexo-concave relationship with the walls. The walls are covered on their outer periphery with a material which is resistant to the growth of the bumpers to control the growth of the bumpers at the periphery of the walls as the bumper is grown into the walls. The final step is removing either the bumpers from the walls or removing the walls from the bumpers leaving either a generally bowl shaped element or a round shaped element respectively on the substrate. In addition the walls may be implanted with a dopant to further control the shape of the bumper. When the generally bowl shaped element is made from silicon, it can be utilized as an optical mirror.

Abstract: A method of fabricating a micromechanical structure of a rod enclosed by a casing and able to both slide and rotate in the casing is described. The rod is formed on a substrate by growing a cylinder into a wall. The wall is then removed leaving the cylinder. The cylinder is coated with a sacrificial layer and a structural layer. The structural layer is patterend to form the casing and the sacrificial layer is removed.

Abstract: A process in which concave surfaces to form undercut edges can be made and the application of such process to making micromechanical devices. Concave surfaces forming undercut edges are made in a wall of a stationary structure extending from a planar surface by growing a convex bumper into the wall. The bumper forms a convexo-concave relationship with the wall. The bumper is then removed from the wall in such a manner as to preserve the concave, undercut surface of the wall. The stationary structure and the planar surface is then further processed by coating with a sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by the curved, undercut edge such as the slot in a slider. Final processing includes removing the sacrificial layer to free the movable structure from the stationary structure.

Abstract: A process in which concave surfaces to form undercut edges can be made and the application of such process to making micromechanical devices. Concave surfaces forming undercut edges are made in a wall of a stationary structure extending from a planar surface by growing a convex bumper into the wall. The bumper forms a convexo-concave relationship with the wall. The bumper is then removed from the wall in such a manner as to preserve the concave, undercut surface of the wall. The stationary structure and the planar surface is then further processed by coating with a sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by the curved, undercut edge such as the slot in a slider. Final processing includes removing the sacrificial layer to free the movable structure from the stationary structure.

Abstract: A microelectronic device and a method of forming the same are disclosed. The microelectronic device includes a cathode, an anode and a first grid disposed adjacent a major surface of a substrate. The first grid is positioned between the cathode and the anode. The first grid is formed from conductive material using a sidewall spacer technique. The anode is made of conductive polysilicon, the cathode is made of tungsten and has a portion elevated from the substrate to aid in the ballistic transport of electrons. A second grid is formed using a sidewall spacer technique, and is positioned between the first grid and the anode. The method of making a microelectronic device includes forming an anode and a cathode on a surface of a substrate, then depositing, in series, first and second sacrificial layers. A first wall is formed by removing portion of the second sacrificial layer. The first wal is positioned between the anode and the cathode.

Abstract: A method for forming on a substrate a microelectronic device having a first and second element. According to the method, a first conductive layer is deposited on the surface. Next, a cap material is deposited, then the first element and a first element cap are formed from the first conductive layer and the cap material respectively. A sacrificial material is conformally deposited, then a second conductive layer is conformally deposited. The second conductive layer is anisotropically etched to form the second element. Finally, the sacrificial material is anisotropically etched.