Abstract: A chassis structure is disclosed. The chassis structure has a chassis with a storage space and a computer node. The storage space is provided for accommodating the computer node. The node has a body removably stored in the storage space. The body has a front and a back portion. The node has a tray frame located in the front portion. The node has a sliding assembly for longitudinally and slideably moving the tray frame between a received and a withdrawn position. The back portion has a first and a second ducting structure, and is provided for accommodating two components. The first ducting structure disposed over the first component, and the second ducting structure disposed over the second component. The first ducting structure is offset from the second ducting structure for guiding different portions of the fluid flow over the first component and the second component, respectively.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: “A chassis structure is disclosed. The chassis structure has a chassis with a storage space and a computer node. The storage space is provided for accommodating the computer node. The node has a body removably stored in the storage space. The body has a front and a back portion. The node has a tray frame located in the front portion. The node has a sliding assembly for longitudinally and slideably moving the tray frame between a received and a withdrawn position. The back portion has a first and a second ducting structure, and is provided for accommodating two components. The first ducting structure disposed over the first component, and the second ducting structure disposed over the second component. The first ducting structure is offset from the second ducting structure for guiding different portions of the fluid flow over the first component and the second component, respectively.