Abstract: A method identifies a location of a fault on a faulty line of an electrical power supply network having a plurality of lines, a plurality of inner nodes, and at least three outer nodes. The outer nodes each bound a line and are provided with measurement devices which are used to measure high-frequency current and/or voltage signals. To locate faults, one of the outer nodes is selected as the starting node for the search for the fault location. Starting from the starting node, paths to the other outer nodes are determined, and that those paths on which the fault location could be located are selected. A line on which the fault location could be located, in principle, is identified for each of the selected paths using the respective times at which the traveling waves arrive, and a potential fault location is determined for the respectively identified line.

Abstract: A method identifies a location of a fault on a faulty line of an electrical power supply network having a plurality of lines, a plurality of inner nodes, and at least three outer nodes. The outer nodes each bound a line and are provided with measurement devices which are used to measure high-frequency current and/or voltage signals. To locate faults, one of the outer nodes is selected as the starting node for the search for the fault location. Starting from the starting node, paths to the other outer nodes are determined, and that those paths on which the fault location could be located are selected. A line on which the fault location could be located, in principle, is identified for each of the selected paths using the respective times at which the traveling waves arrive, and a potential fault location is determined for the respectively identified line.

Abstract: Provided is an in-field apparatus and method for automatic localization of a fault having occurred at power transmission lines of a power supply system, the in-field apparatus includes a preprocessing unit configured to process measured voltage and/or current raw time series data of the power transmission lines to provide a normalized raw data and/or feature representation of the measured raw time series data, and an artificial intelligence module configured to predict an optimal evaluation time used for evaluation of the measured voltage and/or current raw time series data to localize the fault based on the normalized raw data and/or feature representation.

Abstract: A method for deployment of a machine learning model (MLM) on a target field device is disclosed herein. The method includes automatically generating a set of source code files based on the machine learning model, wherein the set of source code files is configured to execute the machine learning model according to predetermined capabilities of the target field device; transforming the generated source code files into a model binary using a tool chain specific to the target field device; and deploying the model binary in a memory of the target field device.

Abstract: A method for deployment of a machine learning model (MLM) on a target field device is disclosed herein. The method includes automatically generating a set of source code files based on the machine learning model, wherein the set of source code files is configured to execute the machine learning model according to predetermined capabilities of the target field device; transforming the generated source code files into a model binary using a tool chain specific to the target field device; and deploying the model binary in a memory of the target field device.

Abstract: Provided is an in-field apparatus and method for automatic localization of a fault having occurred at power transmission lines of a power supply system, the in-field apparatus includes a preprocessing unit configured to process measured voltage and/or current raw time series data of the power transmission lines to provide a normalized raw data and/or feature representation of the measured raw time series data, and an artificial intelligence module configured to predict an optimal evaluation time used for evaluation of the measured voltage and/or current raw time series data to localize the fault based on the normalized raw data and/or feature representation.

Abstract: Device for removing moisture and/or another substance from ambient air or from a gas, the device being configured to operate alternately in an adsorption phase and a desorption phase. The device comprises a vessel comprising an entry and an exit which comprise valves allowing the exit and entry to be opened and closed and a body of adsorption material positioned inside the vessel dividing the inside of the vessel in an upstream region and a downstream region. The device further comprises a condenser loop comprising a condenser located outside the vessel, a branch conduit which extends from the vessel to the condenser and which allows a branch flow of air or gas to flow from the downstream region to the condenser, and a condenser return conduit which extends from the condenser to the vessel and which allows the branch flow to return from the condenser to the upstream region of the vessel.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.

Abstract: A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism. The heating mechanism preferably comprises a heated substrate support adapted to support a substrate and to heat the supported substrate to a predetermined temperature, and the cooling mechanism preferably comprises a cooling plate. The transfer mechanism may comprise, for example, a wafer lift hoop having a plurality of fingers adapted to support a substrate, or a plurality of wafer lift pins. A dry gas source may be coupled to the chamber and adapted to supply a dry gas thereto.

Abstract: Method and apparatus for retaining a workpiece in a process chamber of a semiconductor wafer processing system. The apparatus has a mechanical clamp for clamping the periphery of the workpiece to a pedestal and an electrostatic clamp for clamping the center of the workpiece to the pedestal.

Abstract: A chamber for depositing a film layer on a substrate includes a support member on which the substrate is positioned for processing in the chamber, and a clamp ring suspended in the chamber on a chamber shield. The support member is positionable in the chamber to receive a substrate thereon, and further positionable to pass the substrate through the shield and thereby lift the clamp ring off the shield. After deposition is complete, the support member retracts through the shield, to reposition the clamp on the shield. In the event that a deposition material layer has formed between the substrate and the clamp ring, the clamp ring includes a plurality of actuators thereon which force the substrate out of the clamp ring as the clamp ring is repositioned on the shield.

Abstract: The present invention provides a method and apparatus for protecting the edge of a substrate and securing the substrate to the support member during processing. The present invention preferably provides minimal contact with the substrate and provides improved edge exclusion. Support tabs extend inwardly from the lower roof surface to support the apparatus on the substrate and the inner terminus of the apparatus approaches the edge of the substrate to provide the improved edge exclusion. A variable height lower roof surface is provided over the edge of the substrate to provide an effective increased roof aspect ratio (width of the roof:height of the roof above the substrate) over the edge of the substrate which reduces the likelihood that a bridging layer will form between the apparatus and the substrate or beyond the substrate.