Patents by Inventor Igor LEVINSKY

Igor LEVINSKY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230278742
    Abstract: An autonomous packing apparatus, including a body, a shelf coupled to the body for placing goods, a shelf actuator for moving the shelf relative to the body, output device for outputting a packing material for packing the goods while the goods are located on the shelf, a computerized management system coupled to the shelf actuator and to the output device, including a set of instructions for outputting a first portion of the packing material before the goods are placed on the shelf, moving the shelf after the goods are placed on the shelf, and outputting a second portion of the packing material after the goods are placed on the shelf.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 7, 2023
    Inventors: DIMA KRIVITSKY, IGOR LEVINSKY, ITAI PRICE, AMIT AVIZEMIL, YADIN AHARONI, RAZI BERG, ROEE TUVAL, EYAL YAIR
  • Publication number: 20230202047
    Abstract: A fully autonomous delivery station, including a management unit for receiving orders for goods, and a housing including one or more storage devices containing goods to be delivered, a moving collector moving between the one or more storage devices for collecting the goods, and kiosk used by a user of the delivery station for receiving the goods outside the housing.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 29, 2023
    Inventors: ROEE TUVAL, IGOR LEVINSKY, DAVID PRIVE, ITAI PRICE, YADIN AHARONI, EYAL YAIR
  • Publication number: 20230175866
    Abstract: An electronics system has a board with a thermal interface having an exposed surface. A thermoelectric device is placed against the thermal interface to heat the board. Heat transfers through the board from a first region where the thermal interface is located to a second region where an electronics device is mounted. The electronics device has a temperature sensor that detects the temperature of the electronics device. The temperature of the electronics device is used to calibrate an accelerometer and a gyroscope in the electronics device. Calibration data includes a temperature and a corresponding acceleration offset and a corresponding angle offset. A field computer simultaneously senses a temperature, an acceleration and an angle from the temperature sensor, accelerometer and gyroscope and adjusts the measured data with the offset data at the same temperature. The field computer provides corrected data to a controlled system.
    Type: Application
    Filed: January 30, 2023
    Publication date: June 8, 2023
    Applicant: Magic Leap, Inc.
    Inventors: Cuthbert Martindale ALLEN, Michael Derek ABBOTT, Igor LEVINSKY, Jeffrey JOHNSON, Shimon GOLDSTEIN, Aaron Mark SCHUELKE
  • Patent number: 11598651
    Abstract: An electronics system has a board with a thermal interface having an exposed surface. A thermoelectric device is placed against the thermal interface to heat the board. Heat transfers through the board from a first region where the thermal interface is located to a second region where an electronics device is mounted. The electronics device has a temperature sensor that detects the temperature of the electronics device. The temperature of the electronics device is used to calibrate an accelerometer and a gyroscope in the electronics device. Calibration data includes a temperature and a corresponding acceleration offset and a corresponding angle offset. A field computer simultaneously senses a temperature, an acceleration and an angle from the temperature sensor, accelerometer and gyroscope and adjusts the measured data with the offset data at the same temperature. The field computer provides corrected data to a controlled system.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: March 7, 2023
    Assignee: Magic Leap, Inc.
    Inventors: Cuthbert Martindale Allen, Michael Derek Abbott, Igor Levinsky, Jeffrey Johnson, Shimon Goldstein, Aaron Mark Schuelke
  • Publication number: 20210164804
    Abstract: An electronics system has a board with a thermal interface having an exposed surface. A thermoelectric device is placed against the thermal interface to heat the board. Heat transfers through the board from a first region where the thermal interface is located to a second region where an electronics device is mounted. The electronics device has a temperature sensor that detects the temperature of the electronics device. The temperature of the electronics device is used to calibrate an accelerometer and a gyroscope in the electronics device. Calibration data includes a temperature and a corresponding acceleration offset and a corresponding angle offset. A field computer simultaneously senses a temperature, an acceleration and an angle from the temperature sensor, accelerometer and gyroscope and adjusts the measured data with the offset data at the same temperature. The field computer provides corrected data to a controlled system.
    Type: Application
    Filed: July 23, 2019
    Publication date: June 3, 2021
    Applicant: Magic Leap, Inc.
    Inventors: Cuthbert Martindale ALLEN, Michael Derek ABBOTT, Igor LEVINSKY, Jeffrey JOHNSON, Shimon GOLDSTEIN, Aaron Mark SCHUELKE