Patents by Inventor Igor LOPANENKO

Igor LOPANENKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12608532
    Abstract: An electronic design automation (EDA) tool and system for physical verification of workflow for semiconductor circuit designs, and methods of using the same is described. Generally, the method includes (i) automatic splitting an integrated circuit (IC) layout into a number of windows for parallel processing using a plurality of central processing cores; (ii) extracting parasitic capacitance structures from the IC layout; (iii) generating fill elements for masks to fabricate an IC having the IC layout using a metadata matrix to minimize volume of information and resources needed; and (iv) extraction of parasitic resistance structures from IC layout. In some embodiments, the IC layout is additionally or alternatively split into groups of rules for processing. Other embodiments are also described.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 21, 2026
    Assignee: SILVACO, INC.
    Inventors: Nikolay Grudanov, Valery Bobovsky, Igor Lopanenko, Yuri Levsky, Alexander Grudanov
  • Publication number: 20230334216
    Abstract: An electronic design automation (EDA) tool and system for physical verification of workflow for semiconductor circuit designs, and methods of using the same is described. Generally, the method includes (i) automatic splitting an integrated circuit (IC) layout into a number of windows for parallel processing using a plurality of central processing cores; (ii) extracting parasitic capacitance structures from the IC layout; (iii) generating fill elements for masks to fabricate an IC having the IC layout using a metadata matrix to minimize volume of information and resources needed; and (iv) extraction of parasitic resistance structures from IC layout. In some embodiments, the IC layout is additionally or alternatively split into groups of rules for processing. Other embodiments are also described.
    Type: Application
    Filed: September 23, 2021
    Publication date: October 19, 2023
    Applicant: SILVACO, INC.
    Inventors: Nikolay GRUDANOV, Valery BOBOVSKY, Igor LOPANENKO, Yuri LEVSKY, Alexander GRUDANOV