Abstract: Embodiments herein relate to a Printed Circuit Board, PCB, (1) and a terminal (2) for connecting the PCB (1) to an electrical component. The PCB (1) comprises a through-hole (11) for receiving the terminal (2). The through-hole (11) has a partially open side wall (12), wherein the side wall (12) is open along at least a part of a length (L) of the 5 through-hole (11) perpendicular to a radius (R) of the through-hole (11). This allows the terminal (2) to protrude through the open side wall (12) when received by the through-hole (11), such that a position of the terminal (2) is adjustable along the length of the open side wall (12). The terminal (2) comprises a base (21), adapted to be received by the through-hole (11) of the PCB (1) and to create a press fit with the side wall (12) of the through-hole 10 (11), and a pin (22) projecting from a surface (23) of the base (21).

Abstract: The invention is directed towards a power source interface module for electronic circuits supplied by power from a power source as well as a power supply arrangement for electronic circuits comprising such a power source interface module. The module comprises a first circuit board carrying components, the first circuit board comprising a number of stacked circuit board layers as well as at least two openings, at least a part of a filter comprising at least one pair of magnetically coupled inductive coils, a core with two core legs, each core leg stretching through a corresponding opening in the circuit board, wherein each coil is wound around a corresponding core leg, the turns of the coils stretch through the circuit board layers, and each layer between an upper outer layer and a lower outer layer comprises at least a part of one turn.

Abstract: Embodiments herein relate to a Printed Circuit Board, PCB, (1) and a terminal (2) for connecting the PCB (1) to an electrical component. The PCB (1) comprises a through-hole (11) for receiving the terminal (2). The through-hole (11) has a partially open side wall (12), wherein the side wall (12) is open along at least a part of a length (L) of the 5 through-hole (11) perpendicular to a radius (R) of the through-hole (11). This allows the terminal (2) to protrude through the open side wall (12) when received by the through-hole (11), such that a position of the terminal (2) is adjustable along the length of the open side wall (12). The terminal (2) comprises a base (21), adapted to be received by the through-hole (11) of the PCB (1) and to create a press fit with the side wall (12) of the through-hole 10 (11), and a pin (22) projecting from a surface (23) of the base (21).

Abstract: The invention is directed towards a power source interface module for electronic circuits supplied by power from a power source as well as a power supply arrangement for electronic circuits comprising such a power source interface module. The module comprises a first circuit board carrying components, the first circuit board comprising a number of stacked circuit board layers as well as at least two openings, at least a part of a filter comprising at least one pair of magnetically coupled inductive coils, a core with two core legs, each core leg stretching through a corresponding opening in the circuit board, wherein each coil is wound around a corresponding core leg, the turns of the coils stretch through the circuit board layers, and each layer between an upper outer layer and a lower outer layer comprises at least a part of one turn.

Abstract: A connection pin comprising a first contact part that is adapted for mounting in a hole in a printed circuit board (PCB), and a second contact part. The first contact part comprises a cavity surrounded by a wall, and the wall has at least one opening. At least one solder preform is located in the cavity. A converter assembly comprising a first PCB, and having at least one hole in which a connection pin is mounted. The first PCB with the connection pin is then mounted on a second PCB. Further is described a method for manufacturing a connection pin comprising: providing a connection pin with a cavity in a contact part of the pin, and providing at least one opening in a wall of the cavity, preparing at least one solder preform, and inserting at least one solder preform into the cavity.

Abstract: A connection pin for mounting in a through-hole of a component carrier, comprising an anchoring part adapted for insertion into said through-hole with a non press fit, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The anchoring part is provided an internal cavity and the anchoring part comprises a wall surrounding the internal cavity, which wall has at least two wall portions forming deformation zones and adapted to be located in the through-hole when the anchoring part is inserted in the through-hole, such that, upon exertion of a force on a free end of the anchoring part of the pin when the anchoring part is inserted in the through-hole, the deformation zones are deformed within the through-hole to press fit the connection pin in the through-hole.

Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract: The present invention relates to a thermo/electrical conductor arrangement for multilayer printed circuit boards (PCBs). Using vias for the transport of heat from the interior of the PCB and for conducting high currents between the conducting layers have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin of a current conductive material (such as copper) into the via so that the pin is brought into galvanic contact with the conducting layers in the PCB and where at least one end of the pin is freely protruding from the PCB thereby allowing the pin to conduct heat from the interior of the PCB to the protruding end of the pin for external cooling.

Abstract: A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.

Abstract: The present invention relates to a printed circuit board arrangement and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board having an electrical connection electrically connecting a first conductive layer on a first side of the printed circuit board and a second conductive layer on a second side of the printed circuit board. The electrical connection comprises a passage extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material is formed on the walls of the passage and forms a first path electrically connecting the first conductive layer with the second conductive layer.

Abstract: The present invention relates to a thermo/electrical conductor arrangement for multilayer printed circuit boards (PCBs). Using vias for the transport of heat from the interior of the PCB and for conducting high currents between the conducting layers have limitations. Via platings are very thin and vias filled with solder is an unreliable method as there is always a risk that the vias are not properly filled during the soldering process. The present invention overcomes this by inserting a pin of a current conductive material (such as copper) into the via so that the pin is brought into galvanic contact with the conducting layers in the PCB and where at least one end of the pin is freely protruding from the PCB thereby allowing the pin to conduct heat from the interior of the PCB to the protruding end of the pin for external cooling.

Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract: A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.

Abstract: A connection pin for mounting in a through-hole of a component carrier, comprising an anchoring part adapted for insertion into said through-hole with a non press fit, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The anchoring part is provided an internal cavity and the anchoring part comprises a wall surrounding the internal cavity, which wall has at least two wall portions forming deformation zones and adapted to be located in the through-hole when the anchoring part is inserted in the through-hole, such that, upon exertion of a force on a free end of the anchoring part of the pin when the anchoring part is inserted in the through-hole, the deformation zones are deformed within the through-hole to press fit the connection pin in the through-hole.